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The Thin Wafer Market size was valued at USD 12.57 Billion in 2023 & expects good growth by reaching USD 30.16 billion till the end of 2032 at a CAGR of about 10.29 % during the forecast period 2024-2032.
The abundance of data is fueling an increase in the need for semiconductors. Efficient packaging is necessary for these essential chips in our electronics, as miniaturization trends continue. Thin wafers are the solution, and there is a promising outlook for substantial growth in the market for these extremely thin components. The growth of MEMS technology, combining electrical and mechanical parts in small devices for various applications, is also contributing to this. Highlighting this expansion, Infineon, a major semiconductor company, recently opened a huge €1.6 billion chip plant in Austria specifically tailored for manufacturing power electronics on 300-millimeter thin wafers. This investment highlights the increasing significance of thin wafers in addressing the needs of our data-centric society.
The conventional solar cell market is currently in control, but there is a promising opportunity in flexible, lightweight thin silicon solar cells. Yet, the potential of this exciting market has been hindered by the fragility of these extremely thin wafers, resulting in breakage while being manufactured. Scientists have created a novel technique called TSRR (thin silicon with reinforced ring) to enhance the durability of the wafers' edges. This method has effectively created thin silicon wafers that stand on their own and reached high efficiency (greater than 20%) in operating solar cells – all while maintaining a nearly zero rate of breakage. Even simulations indicate that improving the width of the ring in the TSRR design can increase effectiveness. The method has been verified to work well with current manufacturing processes, allowing for large-scale production to begin. Essentially, TSRR provides a remedy for the issue of fragility, which could open up the extensive market opportunities for thin silicon solar cells that are lightweight and flexible. This advancement may result in fresh uses for solar technology, marking a major breakthrough in the industry.
Drivers
Ever-growing digital consumption is driving the thin wafer market due to their ability to miniaturize electronics for more powerful and portable devices.
The growing amount of data we generate drives an endless need for increasingly powerful semiconductor devices. The small brains found in electronic devices, such as microprocessors and memory chips, play a crucial role in our digital society, enabling the functioning of devices like smartphones, laptops, and data centers housing vast amounts of data. Picture a data center - a large storage facility packed with rows of computer racks. Each rack houses multiple servers, all requiring strong processors and memory to manage the continuous data flow. With the exponential growth of data, data centers constantly need increased processing power. This results in a growing need for these small semiconductor devices. This is the point where thin wafers play a role. These are the extremely slim units utilized in creating these necessary parts. Similar to how constructing a skyscraper necessitates durable, lightweight materials, slim wafers provide an answer for fitting increased processing capability into tighter areas.
The miniaturization needs of MEMS technology in portable health monitors and other tiny devices are driving the thin wafer market.
MEMS technology is leading the way in the shrinking world of technology. Picture a small device that is small enough to be placed on the tip of your finger, but has the capability to detect your movements, gauge pressure, or identify chemicals. These are Microelectromechincal Systems (MEMS), examples of engineering excellence that combine electrical and mechanical parts at a very small size. Thin wafers, extremely thin slices of silicon or other materials, offer the perfect foundation for constructing these tiny wonders. Their accurate measurements and polished exteriors enable the creation of detailed electrical circuits and fragile mechanical structures through micro fabrication methods on their surface. This enables the development of small beams, gears, and chambers that collaborate to carry out intricate tasks. A thin wafer with a MEMS accelerometer could be crucial in tracking your movements and activity levels. In the same way, a thin-wafer-based MEMS pressure sensor installed in your car's airbag system has the ability to detect a sudden impact and initiate deployment within milliseconds. The uses are wide-ranging and constantly growing, ranging from the gyroscopes in your smartphone that maintain game orientation to the microfluidic channels in medical diagnostic chips. Thin wafers provide an ideal blend of durability, bendability, and ease of production for MEMS technology. They enable the development of tiny, dependable, and affordable devices that are changing different industries. When you use a modern electronic device, think about the hidden power of thin wafers that make MEMS technology possible and bring innovative features to our fingertips.
Restraints
Limited efficiency gains in thin wafers can hinder their competitiveness in the solar cell market.
The resource advantage of thin silicon wafers comes at a cost: lower efficiency. Imagine a solar cell as a light sponge. Thicker wafers, like denser sponges, soak up more sunlight, generating more power. Thinner versions capture less light, sacrificing efficiency. The challenge lies in finding the sweet spot – a wafer thin enough to save material but thick enough to absorb light effectively. Researchers are exploring light-trapping designs and light-concentrating materials to boost light absorption in thin wafers, paving the way for a more sustainable and efficient solar cell technology.
The major obstacle of beginning in thin wafers can lead to expensive challenges.
Entering the world of thin wafers offers great potential, but for newcomers, the challenge can be likened to scaling a mountain. Picture a large factory space - to produce these thin wafers, you must have a range of advanced machinery. Advanced equipment for precision thinning of silicon wafers, as well as cutting-edge cleaning and processing tools, all have a high cost. This financial hardship poses a significant obstacle, especially for newcomers and smaller businesses. The elevated expenses can suppress rivalry and impede creativity within the marketplace. Picture a skilled businessperson with a fantastic concept for an innovative thin-wafer gadget. Yet, their aspirations may be thwarted by the substantial amount of funds required to begin, restricting the variety of ideas and strategies present in the market. Sustaining these sophisticated machines also necessitates continuous financial commitment. Routine maintenance, adjustment, and possible enhancements contribute to the overall expenses.
In the Thin Wafer Market, Dicing holds a 45% market share in 2023, led by technology. The need for ultra-thin wafer dicing arises from the increasing memory capacity and continuous package miniaturization. Lately, there has been an increase in the utilization of RFID tags and SIP (system in package) in smartphones and other compact electronic devices. Consequently, there has been a rapid rise in the manufacturing of semiconductor dies that are 100 µm thin or thinner. The growing demand for thin wafers has become an essential expertise for many integrated device manufacturers. The increasing requirement for wafer dicing machines that can operate at high speeds and are highly resistant to breakage has caused a rise in the demand for this type of equipment.
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By Application, CMOS Image Sensor (CIS) dominates with a 25% market share in 2023. Small cameras called CMOS image sensors (CIS) are commonly seen in smartphones and various devices, driving the need for thin wafers. As our gadgets shrink, the chips they need also get smaller, leading to the need for standard and very thin wafers in their manufacturing. Thin wafers are perfect for creating these small CIS chips. The growing demand for top-notch cameras in increasingly compact devices is a major driver of the successful thin wafer market.
Asia Pacific dominates the thin wafer market in 2023 with a market share of 42%. Asia Pacific is crucial for the growth of the electrical and electronics sector. Several top thin wafer manufacturers, including Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), and Global Wafers Co., Ltd. Asia Pacific is where DISCO Corporation (Japan) and Taiwan are located. The rapid expansion of the Asia Pacific region is due to the increasing popularity of advanced consumer electronics like wearables and smart home gadgets in China and Japan. Due to favorable economic conditions and rising demand for consumer electronics, significant growth in the Asia Pacific region is anticipated in the global semiconductor market. Due to the affordable labor in Asia Pacific, a majority of thin wafers and wafer thinning equipment are produced in the region and then shipped to different areas.
North America region is the fastest growing in the thin wafer market, holding a significant 23% market share in 2023. The United States has a huge consumer electronics sector. The constant desire for smaller and more powerful electronics drives the demand for thin wafers. In addition to consumer electronics, healthcare and automotive industries in North America also have a significant impact. Consider the most recent medical imaging machinery or cutting-edge driver-assistance systems found in vehicles – these technologies frequently depend on slender wafer-based parts. North America's position is further solidified by the presence of top thin wafer manufacturers in the region. These established participants not just serve the needs of the local market but also stimulate creativity within the sector.
Some of the major players are Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), Applied Materials (US), Mechatronic Systemtechnik (Austria), Synova (Switzerland), Brewer Science (US), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US), Wafer World Inc. (US), Silicon Valley Microelectronics (US), Shanghai Simgui Technology Co., Ltd. (China), PV Crystalox Solar PLC (UK) and others.
Recent Development
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | USD 12.53 billion |
| Market Size by 2032 | USD 30.16 Billion |
| CAGR | CAGR of 10.29% From 2024 to 2032 |
| Base Year | 2023 |
| Forecast Period | 2024-2032 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Technology (Grinding ,Polishing ,Dicing) • By Wafer Size (125 mm ,200 mm ,300 mm ) • By Process(Temporary Bonding & Debonding ,Carrier-less/Taiko Process ) • By Application (Microelectromechincal system (MEMS) ,CMOS Image Sensor (CIS),Memory ,Radio Frequency (RF) Devices ,Light-emitting Diode (LED) ,Interposer ,Logic ,Others) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia, Rest of Latin America) |
| Company Profiles | Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), Applied Materials (US), Mechatronic Systemtechnik (Austria), Synova (Switzerland), Brewer Science (US), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US), Wafer World Inc. (US), Silicon Valley Microelectronics (US), Shanghai Simgui Technology Co., Ltd. (China), PV Crystalox Solar PLC (UK) |
| Key Drivers | • Ever-growing digital consumption is driving the thin wafer market due to their ability to miniaturize electronics for more powerful and portable devices. • The miniaturization needs of MEMS technology in portable health monitors and other tiny devices are driving the thin wafer market. |
| RESTRAINTS | • Limited efficiency gains in thin wafers can hinder their competitiveness in the solar cell market. • The major obstacle of beginning in thin wafers can lead to expensive challenges. |
Ans. The thin wafer market is driven by surging demand for miniaturized electronics, MEMS technology adoption, and the expansion of the solar energy sector.
Ans. The Thin Wafer market size was valued at USD 11.40 Billion in 2023 & expects good growth by reaching USD 30.16 billion by the end of 2032 at a CAGR of about 10.29 % during the forecast period 2024-2032.
Ans. North America region is to record the Fastest Growing in the Thin Wafer market.
Ans. The Dicing Segment is leading in the market revenue share in 2023.
Ans. Asia Pacific is to hold the largest market share in the thin wafer market during the forecast period.
TABLE OF CONTENTS
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Industry Flowchart
3. Research Methodology
4. Market Dynamics
4.1 Drivers
4.2 Restraints
4.3 Opportunities
4.4 Challenges
5. Porter’s 5 Forces Model
6. Pest Analysis
7. Thin Wafer Market Segmentation, By Technology
7.1 Introduction
7.2 Grinding
7.3 Polishing
7.4 Dicing
8. Thin Wafer Market Segmentation, By Process
8.1 Introduction
8.2 Temporary Bonding & Debonding
8.3 Carrier-less/Taiko Process
9. Thin Wafer Market Segmentation, By Wafer Size
9.1 Introduction
9.2 125 mm
9.3 200 mm
9.4 300 mm
10. Thin Wafer Market Segmentation, By Application
10.1 Introduction
10.2 Microelectromechincal system (MEMS)
10.3 CMOS Image Sensor (CIS)
10.4 Memory
10.5 Radio Frequency (RF) Devices
10.6 Light-emitting Diode (LED)
10.7 Interposer
10.8 Logic
10.9 Others
11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1 Trend Analysis
11.2.2 North America Thin Wafer Market by Country
11.2.3 North America Thin Wafer Market By Technology
11.2.4 North America Thin Wafer Market By Process
11.2.5 North America Thin Wafer Market By Wafer Size
11.2.6 North America Thin Wafer Market By Application
11.2.7 USA
11.2.7.1 USA Thin Wafer Market By Technology
11.2.7.2 USA Thin Wafer Market By Process
11.2.7.3 USA Thin Wafer Market By Wafer Size
11.2.7.4 USA Thin Wafer Market By Application
11.2.8 Canada
11.2.8.1 Canada Thin Wafer Market By Technology
11.2.8.2 Canada Thin Wafer Market By Process
11.2.8.3 Canada Thin Wafer Market By Wafer Size
11.2.8.4 Canada Thin Wafer Market By Application
11.2.9 Mexico
11.2.9.1 Mexico Thin Wafer Market By Technology
11.2.9.2 Mexico Thin Wafer Market By Process
11.2.9.3 Mexico Thin Wafer Market By Wafer Size
11.2.9.4 Mexico Thin Wafer Market By Application
11.3 Europe
11.3.1 Trend Analysis
11.3.2 Eastern Europe
11.3.2.1 Eastern Europe Thin Wafer Market by Country
11.3.2.2 Eastern Europe Thin Wafer Market By Technology
11.3.2.3 Eastern Europe Thin Wafer Market By Process
11.3.2.4 Eastern Europe Thin Wafer Market By Wafer Size
11.3.2.5 Eastern Europe Thin Wafer Market By Application
11.3.2.6 Poland
11.3.2.6.1 Poland Thin Wafer Market By Technology
11.3.2.6.2 Poland Thin Wafer Market By Process
11.3.2.6.3 Poland Thin Wafer Market By Wafer Size
11.3.2.6.4 Poland Thin Wafer Market By Application
11.3.2.7 Romania
11.3.2.7.1 Romania Thin Wafer Market By Technology
11.3.2.7.2 Romania Thin Wafer Market By Process
11.3.2.7.3 Romania Thin Wafer Market By Wafer Size
11.3.2.7.4 Romania Thin Wafer Market By Application
11.3.2.8 Hungary
11.3.2.8.1 Hungary Thin Wafer Market By Technology
11.3.2.8.2 Hungary Thin Wafer Market By Process
11.3.2.8.3 Hungary Thin Wafer Market By Wafer Size
11.3.2.8.4 Hungary Thin Wafer Market By Application
11.3.2.9 Turkey
11.3.2.9.1 Turkey Thin Wafer Market By Technology
11.3.2.9.2 Turkey Thin Wafer Market By Process
11.3.2.9.3 Turkey Thin Wafer Market By Wafer Size
11.3.2.9.4 Turkey Thin Wafer Market By Application
11.3.2.10 Rest of Eastern Europe
11.3.2.10.1 Rest of Eastern Europe Thin Wafer Market By Technology
11.3.2.10.2 Rest of Eastern Europe Thin Wafer Market By Process
11.3.2.10.3 Rest of Eastern Europe Thin Wafer Market By Wafer Size
11.3.2.10.4 Rest of Eastern Europe Thin Wafer Market By Application
11.3.3 Western Europe
11.3.3.1 Western Europe Thin Wafer Market by Country
11.3.3.2 Western Europe Thin Wafer Market By Technology
11.3.3.3 Western Europe Thin Wafer Market By Process
11.3.3.4 Western Europe Thin Wafer Market By Wafer Size
11.3.3.5 Western Europe Thin Wafer Market By Application
11.3.3.6 Germany
11.3.3.6.1 Germany Thin Wafer Market By Technology
11.3.3.6.2 Germany Thin Wafer Market By Process
11.3.3.6.3 Germany Thin Wafer Market By Wafer Size
11.3.3.6.4 Germany Thin Wafer Market By Application
11.3.3.7 France
11.3.3.7.1 France Thin Wafer Market By Technology
11.3.3.7.2 France Thin Wafer Market By Process
11.3.3.7.3 France Thin Wafer Market By Wafer Size
11.3.3.7.4 France Thin Wafer Market By Application
11.3.3.8 UK
11.3.3.8.1 UK Thin Wafer Market By Technology
11.3.3.8.2 UK Thin Wafer Market By Process
11.3.3.8.3 UK Thin Wafer Market By Wafer Size
11.3.3.8.4 UK Thin Wafer Market By Application
11.3.3.9 Italy
11.3.3.9.1 Italy Thin Wafer Market By Technology
11.3.3.9.2 Italy Thin Wafer Market By Process
11.3.3.9.3 Italy Thin Wafer Market By Wafer Size
11.3.3.9.4 Italy Thin Wafer Market By Application
11.3.3.10 Spain
11.3.3.10.1 Spain Thin Wafer Market By Technology
11.3.3.10.2 Spain Thin Wafer Market By Process
11.3.3.10.3 Spain Thin Wafer Market By Wafer Size
11.3.3.10.4 Spain Thin Wafer Market By Application
11.3.3.11 Netherlands
11.3.3.11.1 Netherlands Thin Wafer Market By Technology
11.3.3.11.2 Netherlands Thin Wafer Market By Process
11.3.3.11.3 Netherlands Thin Wafer Market By Wafer Size
11.3.3.11.4 Netherlands Thin Wafer Market By Application
11.3.3.12 Switzerland
11.3.3.12.1 Switzerland Thin Wafer Market By Technology
11.3.3.12.2 Switzerland Thin Wafer Market By Process
11.3.3.12.3 Switzerland Thin Wafer Market By Wafer Size
11.3.3.12.4 Switzerland Thin Wafer Market By Application
11.3.3.13 Austria
11.3.3.13.1 Austria Thin Wafer Market By Technology
11.3.3.13.2 Austria Thin Wafer Market By Process
11.3.3.13.3 Austria Thin Wafer Market By Wafer Size
11.3.3.13.4 Austria Thin Wafer Market By Application
11.3.3.14 Rest of Western Europe
11.3.3.14.1 Rest of Western Europe Thin Wafer Market By Technology
11.3.3.14.2 Rest of Western Europe Thin Wafer Market By Process
11.3.3.14.3 Rest of Western Europe Thin Wafer Market By Wafer Size
11.3.3.14.4 Rest of Western Europe Thin Wafer Market By Application
11.4 Asia-Pacific
11.4.1 Trend Analysis
11.4.2 Asia-Pacific Thin Wafer Market by Country
11.4.3 Asia-Pacific Thin Wafer Market By Technology
11.4.4 Asia-Pacific Thin Wafer Market By Process
11.4.5 Asia-Pacific Thin Wafer Market By Wafer Size
11.4.6 Asia-Pacific Thin Wafer Market By Application
11.4.7 China
11.4.7.1 China Thin Wafer Market By Technology
11.4.7.2 China Thin Wafer Market By Process
11.4.7.3 China Thin Wafer Market By Wafer Size
11.4.7.4 China Thin Wafer Market By Application
11.4.8 India
11.4.8.1 India Thin Wafer Market By Technology
11.4.8.2 India Thin Wafer Market By Process
11.4.8.3 India Thin Wafer Market By Wafer Size
11.4.8.4 India Thin Wafer Market By Application
11.4.9 Japan
11.4.9.1 Japan Thin Wafer Market By Technology
11.4.9.2 Japan Thin Wafer Market By Process
11.4.9.3 Japan Thin Wafer Market By Wafer Size
11.4.9.4 Japan Thin Wafer Market By Application
11.4.10 South Korea
11.4.10.1 South Korea Thin Wafer Market By Technology
11.4.10.2 South Korea Thin Wafer Market By Process
11.4.10.3 South Korea Thin Wafer Market By Wafer Size
11.4.10.4 South Korea Thin Wafer Market By Application
11.4.11 Vietnam
11.4.11.1 Vietnam Thin Wafer Market By Technology
11.4.11.2 Vietnam Thin Wafer Market By Process
11.4.11.3 Vietnam Thin Wafer Market By Wafer Size
11.4.11.4 Vietnam Thin Wafer Market By Application
11.4.12 Singapore
11.4.12.1 Singapore Thin Wafer Market By Technology
11.4.12.2 Singapore Thin Wafer Market By Process
11.4.12.3 Singapore Thin Wafer Market By Wafer Size
11.4.12.4 Singapore Thin Wafer Market By Application
11.4.13 Australia
11.4.13.1 Australia Thin Wafer Market By Technology
11.4.13.2 Australia Thin Wafer Market By Process
11.4.13.3 Australia Thin Wafer Market By Wafer Size
11.4.13.4 Australia Thin Wafer Market By Application
11.4.14 Rest of Asia-Pacific
11.4.14.1 Rest of Asia-Pacific Thin Wafer Market By Technology
11.4.14.2 Rest of Asia-Pacific Thin Wafer Market By Process
11.4.14.3 Rest of Asia-Pacific Thin Wafer Market By Wafer Size
11.4.14.4 Rest of Asia-Pacific Thin Wafer Market By Application
11.5 Middle East & Africa
11.5.1 Trend Analysis
11.5.2 Middle East
11.5.2.1 Middle East Thin Wafer Market by Country
11.5.2.2 Middle East Thin Wafer Market By Technology
11.5.2.3 Middle East Thin Wafer Market By Process
11.5.2.4 Middle East Thin Wafer Market By Wafer Size
11.5.2.5 Middle East Thin Wafer Market By Application
11.5.2.6 UAE
11.5.2.6.1 UAE Thin Wafer Market By Technology
11.5.2.6.2 UAE Thin Wafer Market By Process
11.5.2.6.3 UAE Thin Wafer Market By Wafer Size
11.5.2.6.4 UAE Thin Wafer Market By Application
11.5.2.7 Egypt
11.5.2.7.1 Egypt Thin Wafer Market By Technology
11.5.2.7.2 Egypt Thin Wafer Market By Process
11.5.2.7.3 Egypt Thin Wafer Market By Wafer Size
11.5.2.7.4 Egypt Thin Wafer Market By Application
11.5.2.8 Saudi Arabia
11.5.2.8.1 Saudi Arabia Thin Wafer Market By Technology
11.5.2.8.2 Saudi Arabia Thin Wafer Market By Process
11.5.2.8.3 Saudi Arabia Thin Wafer Market By Wafer Size
11.5.2.8.4 Saudi Arabia Thin Wafer Market By Application
11.5.2.9 Qatar
11.5.2.9.1 Qatar Thin Wafer Market By Technology
11.5.2.9.2 Qatar Thin Wafer Market By Process
11.5.2.9.3 Qatar Thin Wafer Market By Wafer Size
11.5.2.9.4 Qatar Thin Wafer Market By Application
11.5.2.10 Rest of Middle East
11.5.2.10.1 Rest of Middle East Thin Wafer Market By Technology
11.5.2.10.2 Rest of Middle East Thin Wafer Market By Process
11.5.2.10.3 Rest of Middle East Thin Wafer Market By Wafer Size
11.5.2.10.4 Rest of Middle East Thin Wafer Market By Application
11.5.3 Africa
11.5.3.1 Africa Thin Wafer Market by Country
11.5.3.2 Africa Thin Wafer Market By Technology
11.5.3.3 Africa Thin Wafer Market By Process
11.5.3.4 Africa Thin Wafer Market By Wafer Size
11.5.3.5 Africa Thin Wafer Market By Application
11.5.3.6 Nigeria
11.5.3.6.1 Nigeria Thin Wafer Market By Technology
11.5.3.6.2 Nigeria Thin Wafer Market By Process
11.5.3.6.3 Nigeria Thin Wafer Market By Wafer Size
11.5.3.6.4 Nigeria Thin Wafer Market By Application
11.5.3.7 South Africa
11.5.3.7.1 South Africa Thin Wafer Market By Technology
11.5.3.7.2 South Africa Thin Wafer Market By Process
11.5.3.7.3 South Africa Thin Wafer Market By Wafer Size
11.5.3.7.4 South Africa Thin Wafer Market By Application
11.5.3.8 Rest of Africa
11.5.3.8.1 Rest of Africa Thin Wafer Market By Technology
11.5.3.8.2 Rest of Africa Thin Wafer Market By Process
11.5.3.8.3 Rest of Africa Thin Wafer Market By Wafer Size
11.5.3.8.4 Rest of Africa Thin Wafer Market By Application
11.6 Latin America
11.6.1 Trend Analysis
11.6.2 Latin America Thin Wafer Market by Country
11.6.3 Latin America Thin Wafer Market By Technology
11.6.4 Latin America Thin Wafer Market By Process
11.6.5 Latin America Thin Wafer Market By Wafer Size
11.6.6 Latin America Thin Wafer Market By Application
11.6.7 Brazil
11.6.7.1 Brazil Thin Wafer Market By Technology
11.6.7.2 Brazil Thin Wafer Market By Process
11.6.7.3 Brazil Thin Wafer Market By Wafer Size
11.6.7.4 Brazil Thin Wafer Market By Application
11.6.8 Argentina
11.6.8.1 Argentina Thin Wafer Market By Technology
11.6.8.2 Argentina Thin Wafer Market By Process
11.6.8.3 Argentina Thin Wafer Market By Wafer Size
11.6.8.4 Argentina Thin Wafer Market By Application
11.6.9 Colombia
11.6.9.1 Colombia Thin Wafer Market By Technology
11.6.9.2 Colombia Thin Wafer Market By Process
11.6.9.3 Colombia Thin Wafer Market By Wafer Size
11.6.9.4 Colombia Thin Wafer Market By Application
11.6.10 Rest of Latin America
11.6.10.1 Rest of Latin America Thin Wafer Market By Technology
11.6.10.2 Rest of Latin America Thin Wafer Market By Process
11.6.10.3 Rest of Latin America Thin Wafer Market By Wafer Size
11.6.10.4 Rest of Latin America Thin Wafer Market By Application
12. Company Profiles
12.1 Shin-Etsu Chemical Co., Ltd.
12.1.1 Company Overview
12.1.2 Financial
12.1.3 Products/ Services Offered
12.1.4 The SNS View
12.2 SUMCO Corporation
12.2.1 Company Overview
12.2.2 Financial
12.2.3 Products/ Services Offered
12.2.4 The SNS View
12.3 GlobalWafers Co., Ltd.
12.3.1 Company Overview
12.3.2 Financial
12.3.3 Products/ Services Offered
12.3.4 The SNS View
12.4 Siltronic
12.4.1 Company Overview
12.4.2 Financial
12.4.3 Products/ Services Offered
12.4.4 The SNS View
12.5 SK Siltron
12.5.1 Company Overview
12.5.2 Financial
12.5.3 Products/ Services Offered
12.5.4 The SNS View
12.6 SUSS MicroTec
12.6.1 Company Overview
12.6.2 Financial
12.6.3 Products/ Services Offered
12.6.4 The SNS View
12.7 Soitec
12.7.1 Company Overview
12.7.2 Financial
12.7.3 Products/ Services Offered
12.7.4 The SNS View
12.8 DISCO Corporation
12.8.1 Company Overview
12.8.2 Financial
12.8.3 Products/ Services Offered
12.8.4 The SNS View
12.9 3M
12.9.1 Company Overview
12.9.2 Financial
12.9.3 Products/ Services Offered
12.9.4 The SNS View
12.10 Applied Materials
12.10.1 Company Overview
12.10.2 Financial
12.10.3 Products/ Services Offered
12.10.4 The SNS View
13. Competitive Landscape
13.1 Competitive Benchmarking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions
14. Use Case and Best Practices
15. Conclusion
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Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.
Step 2: Primary Research
When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data. This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.
We at SNS Insider have divided Primary Research into 2 parts.
Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.
This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.
Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.
Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.
Step 3: Data Bank Validation
Once all the information is collected via primary and secondary sources, we run that information for data validation. At our intelligence centre our research heads track a lot of information related to the market which includes the quarterly reports, the daily stock prices, and other relevant information. Our data bank server gets updated every fortnight and that is how the information which we collected using our primary and secondary information is revalidated in real time.
Step 4: QA/QC Process
After all the data collection and validation our team does a final level of quality check and quality assurance to get rid of any unwanted or undesired mistakes. This might include but not limited to getting rid of the any typos, duplication of numbers or missing of any important information. The people involved in this process include technical content writers, research heads and graphics people. Once this process is completed the title gets uploader on our platform for our clients to read it.
Step 5: Final QC/QA Process:
This is the last process and comes when the client has ordered the study. In this process a final QA/QC is done before the study is emailed to the client. Since we believe in giving our clients a good experience of our research studies, therefore, to make sure that we do not lack at our end in any way humanly possible we do a final round of quality check and then dispatch the study to the client.
Key Segments:
By Technology
Grinding
Polishing
Dicing
By Wafer Size
125 mm
200 mm
300 mm
By Process:
Temporary Bonding & Debonding
Carrier-less/Taiko Process
By Application
Microelectromechincal system (MEMS)
CMOS Image Sensor (CIS)
Memory
Radio Frequency (RF) Devices
Light-emitting Diode (LED)
Interposer
Logic
Others
Request for Segment Customization as per your Business Requirement: Segment Customization Request
REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of the Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Request for Country Level Research Report: Country Level Customization Request
Available Customization
With the given market data, SNS Insider offers customization as per the company’s specific needs. The following customization options are available for the report:
Product Analysis
Criss-Cross segment analysis (e.g. Product X Application)
Product Matrix which gives a detailed comparison of product portfolio of each company
Geographic Analysis
Additional countries in any of the regions
Company Information
Detailed analysis and profiling of additional market players (Up to five)
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