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The Thin-Film Encapsulation Market size was valued at USD 110.53 million in 2023 and is expected to grow to USD 549.27 million by 2032 and grow at a CAGR Of 19.5% over the forecast period of 2024-2032.
The term "thin-film encapsulation" refers to a technology that guarantees the defense of flexible devices against water, moisture, and other polluted elements. Usually, it is deposited through both an organic and an inorganic layer. Because of their integration, both the organic and inorganic layers are used. Costs are decreased as a result, while flexibility and capacity are increased. Organic Light-Emitting Diodes (OLED) make use of the invention known as Thin-Film Encapsulation (TFE). A thin film barrier from TFE can take the place of front glass in OLED devices. OLEDs are regarded as new-generation display technology with the rise of wearable technology. Thin-Film Encapsulation (TFE) has emerged as the most promising approach for securing these flexible devices.
The multi-layer film, comprised of varying organic and inorganic layers, is the only component of thin-film encapsulation that is completely necessary. Additionally, each component of the thin-film encapsulation is physically and chemically enhanced to ensure the OLED device's extended lifespan and prevent any injury.
KEY DRIVERS:
Worldwide growth in demand for thin-film barriers in flexible and organic electronics
The incorporation of flexible OLED screens into smartphones and smart wearables is the driving force.
The hybrid encapsulation structure is used in the mass production of flexible OLED panels, covering the organic and inorganic passivation stacks with a gas barrier cover plate. TFE organic materials are mass-produced by Samsung SDI for flexible displays found in smartphones, however Significantly, LG Chem produces barrier coatings for wearable technology. OLEDs are appropriate for smartphone applications due to their strength, flexibility, light weight, thinness, and low power consumption. It is possible to fold, bend, stretch, and even roll OLED devices by using a flexible plastic substrate. Due to this, there is an increase in demand for TFE as well as flexible OLED display panels for high-definition applications such as smartphone screens and HD televisions.
RESTRAIN:
High cost and development of flexible cost
High capital costs related to TFE
The Inkjet printers, PECVD (plasma-enhanced chemical vapor deposition) systems, atomic layer deposition systems, and vacuum thermal evaporation systems are among the tools used for the deposition of thin encapsulant films. These deposition systems are highly expensive. Furthermore, The R&D activities related to issues like contracting geometries, intricate device structures, numerous applications and process steps, and the use of new materials to enhance the quality and technical features of the thin encapsulant films require significant investment from manufacturers of OLED panels and thin film photovoltaics.
OPPORTUNITY:
The market players have profitable potential thanks to the rising demand for thin, high-efficiency solar cells and the significant investments in OLED technology and manufacturing facilities.
Growing market need for thin, highly efficient solar cells.
The need for clean fuel electricity from off-grid locations is growing, which supplements the usage of renewable energy because it produces no pollution. Thin-film solar cells are becoming more prevalent in these places. The need for renewable energy is projected to increase as a result of off-grid electrification projects. The possibility of conformal coating or printing solar devices onto a variety of flexible substrate surfaces has expanded with the development of thin-film and organic photovoltaics, increasing the likelihood of producing solar devices that are both functional and affordable. Polymer-based solar technologies are being employed more frequently because of their capacity to function in dispersed light and their potential for large-scale scalability.
CHALLENGES:
The need for technical expertise and intellectual property protection.
A complex value chain structure is a challenge.
A complicated value chain that includes OLED manufacturers, electronics product makers, material suppliers, technology developers, and equipment manufacturers defines the burgeoning TFE market. Because there are numerous participants, the value chain is dynamic. Which lengthens the time to market and complicates product development.
Some uncertainties have been added to the semiconductor supply chain and automotive demand as a result of Russia's invasion of Ukraine. For instance, Russia provides 25 to 30 percent of the world's palladium, a rare metal needed in semiconductors, while Ukraine provides 25 to 35% of the world's purified neon gas. Another issue is that a lot of semiconductors are shipped by air, yet shipping rates have climbed dramatically while the volume that can be shipped has decreased. Another issue is that OEMs have lowered production quantities as a result of their inability to procure crucial vehicle components, like wiring harnesses, which has increased uncertainty by lowering demand for some semiconductor-based components.
IMPACT OF ONGOING RECESSION
The global economic downturn is having an impact on the Semiconductor or chip industry. In addition. Spending on semiconductor fabs (or chipmaking units) is declining as a result of a decline in global demand from users of electronics and other chips by over 30%. A slowdown in chip demand in India could cause the anticipated investments in semiconductor manufacturing worth Rs 90,000 crore to be postponed. Consumer electronics, which has been hit by the financial crisis, are increasingly driving the semiconductor business. Layoffs have occurred in semiconductor manufacturing and design divisions across the globe.
By Deposition Type
Inorganic Layer Deposition
Plasma-enhanced Chemical Vapor Deposition (PECVD)
Atomic Layer Deposition (ALD)
Sputtering
Organic Layer Deposition
Inkjet Printing
Vacuum Thermal Evaporation (VTE)
By Vertical
Consumer Electronics
Automotive
Sports & Entertainment
Transportation
Retail, Hospitality, and BFSI
Industrial & Enterprise
Education
Healthcare
Aerospace & Defence
Others (Telecommunications, agriculture, and construction)
By Application
Flexible OLED Display
Smartphones
Tablets
TVs & Signages
PC Monitors & Laptops
Smart Wearables
Others (E-readers, gaming consoles, smart mirrors, home appliances, cameras, photo frames, medical devices, industrial displays, and projectors)
Flexible OLED Lighting
Thin-film Photovoltaics
Others (Flexible batteries, architectural materials, and printed electronics)
Asia-Pacific is the thin-film encapsulation market and is predicted to be dominated by Asia-Pacific. The expansion of the regional market is correlated with the development of the electronics and semiconductor sectors, particularly in China. Demand for thin film encapsulation technologies increased as a result of the established electronics manufacturing hubs in South Korea, China, and Taiwan.
Asia Pacific is the region that consumes the most TFE machinery and materials transported globally. The main manufacturing hubs for flexible electronic devices are in China, Japan, Taiwan, South Korea, and Hong Kong.
Germany and other European nations like Russia are the main producers of the automobile industry. because of rising OLED lighting solution investments for automobiles. To develop OLED lighting solutions for automobiles, the majority of the automotive industry collaborated with the lighting manufacturer. In Thin-film encapsulation in North America is largely controlled by solar cell manufacturers.
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REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of the Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Rest of Latin America
The Major Players are Samsung SDI Co., Ltd. (South Korea), LG Chem (South Korea), 3M (US), Toppan Inc.(Japan); Ergis Group (Poland), Veeco Instruments Inc. (US), Universal Display Corporation (US), Applied Materials, Inc. (US), Kateeva (US), Toray Industries, Inc. (Japan), tesa (Germany), Ajinomoto Fine-Techno Co., Inc. (Japan), Coat-X (Switzerland), Borealis AG (Austria).and other players are listed in the final report.
In June 2022, Applied Materials purchased Espoo, Finland-based Picosun, a privately held manufacturer of semiconductor equipment. For international companies, Picosun offers the most cutting-edge ALD (Atomic Layer Deposition) thin-film coating solutions.
Toray Industries created a super high barrier film in April 2022 that is at least 80% less expensive than its traditional rivals. The business hopes to put the film on the market in 2023 for high-barrier performance uses like flexible electronics and solar cell encapsulation.
In September 2021, Ergis Group created a brand-new approach to encapsulating OLED panels. Both the flexible substrate and the encapsulating layer for OLED devices can be implemented using the no Diffusion film, which was created in partnership with Ergis' partners.
| Report Attributes | Details |
| Market Size in 2023 | US$ 110.53 Mn |
| Market Size by 2032 | US$ 549.27 Mn |
| CAGR | CAGR of 19.5 % From 2024 to 2032 |
| Base Year | 2023 |
| Forecast Period | 2024-2032 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Deposition Type (Inorganic Layer Deposition, Organic Layer Deposition) • By Vertical (Consumer Electronics, Automotive, Sports & Entertainment, Transportation, Retail, Hospitality, and BFSI, Industrial & Enterprise, Education, Healthcare, Aerospace & Defence, Others (Telecommunications, agriculture, and construction) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]). Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia Rest of Latin America) |
| Company Profiles | Samsung SDI Co., Ltd. (South Korea); LG Chem (South Korea); 3M (US); Toppan Inc. (Japan); Ergis Group (Poland); Veeco Instruments Inc. (US); Universal Display Corporation (US); Applied Materials, Inc. (US); Kateeva (US); Toray Industries, Inc. (Japan); tesa (Germany); Ajinomoto Fine-Techno Co., Inc. (Japan); Coat-X (Switzerland); and Borealis AG (Austria) |
| Key Drivers | • Worldwide growth in demand for thin-film barriers in flexible and organic electronics • The incorporation of flexible OLED screens into smartphones and smart wearables is the driving force. |
| Market Restraints | • High cost and development of flexible cost • High capital costs related to TFE |
Ans: Thin-film Encapsulation Market is anticipated to expand by 19.5% from 2023 to 2030.
Ans: The Thin-film Encapsulation Market is estimated to reach US$ 384.66 million by 2030.
Ans: Thin-film Encapsulation Market size was valued at USD 92.5 million billion in 2022.
Ans: The Asia Pacific market is dominate the market.
Ans: Worldwide growth in demand for thin-film barriers in flexible and organic electronics and The incorporation of flexible OLED screens into smartphones and smart wearable is the driving force.
Table of Contents
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 Impact of the Russia-Ukraine War
4.2 Impact of Ongoing Recession
4.2.1 Introduction
4.2.2 Impact on major economies
4.2.2.1 US
4.2.2.2 Canada
4.2.2.3 Germany
4.2.2.4 France
4.2.2.5 United Kingdom
4.2.2.6 China
4.2.2.7 Japan
4.2.2.8 South Korea
4.2.2.9 Rest of the World
4.3 Supply Demand Gap Analysis
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. Thin-film Encapsulation Market Segmentation, By Deposition Type
8.1 Inorganic Layer Deposition
8.1.1 Plasma-enhanced Chemical Vapor Deposition (PECVD)
8.1.2 Atomic Layer Deposition (ALD)
8.1.3 Sputtering
8.2 Organic Layer Deposition
8.2.1 Inkjet Printing
8.2.2 Vacuum Thermal Evaporation (VTE)
9. Thin-film Encapsulation Market Segmentation, By Vertical
9.1 Consumer Electronics
9.2 Automotive
9.3 Sports & Entertainment
9.4 Transportation
9.5 Retail, Hospitality, and BFSI
9.6 Industrial & Enterprise
9.7 Education
9.8 Healthcare
9.9 Aerospace & Defence
9.10 Others (Telecommunications, agriculture, and construction)
10. Thin-film Encapsulation Market Segmentation, By Application
10.1 Flexible OLED Display
10.1.1 Smartphones
10.1.2 Tablets
10.1.3 TVs & Signages
10.1.4 PC Monitors & Laptops
10.1.5 Smart Wearables
10.1.6 Automotive Displays
10.1.7 Others (E-readers, gaming consoles, smart mirrors, home appliances, cameras, photo frames, medical devices, industrial displays, and projectors)
10.2 Flexible OLED Lighting
10.3 Thin-film Photovoltaics
10.4 Others (Flexible batteries, architectural materials, and printed electronics)
11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1North America Thin-film Encapsulation Market by Country
11.2.2North America Thin-film Encapsulation Market by Deposition Type
11.2.3 North America Thin-film Encapsulation Market by Vertical
11.2.4 North America Thin-film Encapsulation Market by Application
11.2.5 USA
11.2.5.1 USA Thin-film Encapsulation Market by Deposition Type
11.2.5.3 USA Thin-film Encapsulation Market by Vertical
11.2.5.4 USA Thin-film Encapsulation Market by Application
11.2.6 Canada
11.2.6.1 Canada Thin-film Encapsulation Market by Deposition Type
11.2.6.3 Canada Thin-film Encapsulation Market by Vertical
11.2.6.4 Canada Thin-film Encapsulation Market by Application
11.2.7 Mexico
11.2.7.1 Mexico Thin-film Encapsulation Market by Deposition Type
11.2.7.3 Mexico Thin-film Encapsulation Market by Vertical
11.2.7.4 Mexico Thin-film Encapsulation Market by Application
11.3 Europe
11.3.1 Europe Thin-film Encapsulation Market by Country
1.3.3.2 Europe Thin-film Encapsulation Market by Deposition Type
11.3.3 Europe Thin-film Encapsulation Market by Vertical
11.3.4 Europe Thin-film Encapsulation Market by Application
11.3.5 Germany
11.3.5.1 Germany Thin-film Encapsulation Market by Deposition Type
11.3.5.2 Germany Thin-film Encapsulation Market by Vertical
11.3.5.3 Germany Thin-film Encapsulation Market by Application
11.3.6 UK
11.3.6.1 UK Thin-film Encapsulation Market by Deposition Type
11.3.6.2 UK Thin-film Encapsulation Market by Vertical
11.3.6.3 UK Thin-film Encapsulation Market by Application
11.3.7 France
11.3.7.1 France Thin-film Encapsulation Market by Deposition Type
11.3.7.2 France Thin-film Encapsulation Market by Vertical
11.3.7.3 France Thin-film Encapsulation Market by Application
11.3.8 Italy
11.3.8.1 Italy Thin-film Encapsulation Market by Deposition Type
11.3.8.2 Italy Thin-film Encapsulation Market by Vertical
11.3.8.3 Italy Thin-film Encapsulation Market by Application
11.3.9 Spain
11.3.9.1 Spain Thin-film Encapsulation Market by Deposition Type
11.3.9.2 Spain Thin-film Encapsulation Market by Vertical
11.3.9.3 Spain Thin-film Encapsulation Market by Application
11.3.10 The Netherlands
11.3.10.1 Netherlands Thin-film Encapsulation Market by Deposition Type
11.3.10.2 Netherlands Thin-film Encapsulation Market by Vertical
11.3.10.3 Netherlands Thin-film Encapsulation Market by Application
11.3.11 Rest of Europe
11.3.11.1 Rest of Europe Thin-film Encapsulation Market by Deposition Type
11.3.11.2 Rest of Europe Thin-film Encapsulation Market by Vertical
11.3.11.3 Rest of Europe Thin-film Encapsulation Market by Application
11.4 Asia-Pacific
11.4.1 Asia Pacific Thin-film Encapsulation Market by Country
11.4.2 Asia Pacific Thin-film Encapsulation Market by Deposition Type
11.4.3 Asia Pacific Thin-film Encapsulation Market by Vertical
11.4.4 Asia Pacific Thin-film Encapsulation Market by Application
11.4.5 Japan
11.4.5.1 Japan Thin-film Encapsulation Market by Deposition Type
11.4.5.2 Japan Thin-film Encapsulation Market by Vertical
11.4.5.3 Japan Thin-film Encapsulation Market by Application
11.4.6 South Korea
11.4.6.1 South Korea Thin-film Encapsulation Market by Deposition Type
11.4.6.2 South Korea Thin-film Encapsulation Market by Vertical
11.4.6.3 South Korea Thin-film Encapsulation Market by Application
11.4.7 China
11.4.7.1 China Thin-film Encapsulation Market by Deposition Type
11.4.7.2 China Thin-film Encapsulation Market by Vertical
11.4.7.3 China Thin-film Encapsulation Market by Application
11.4.8 India
11.4.8.1 India Thin-film Encapsulation Market by Deposition Type
11.4.8.2 India Thin-film Encapsulation Market by Vertical
11.4.8.3 India Thin-film Encapsulation Market by Application
11.4.9 Australia
11.4.9.1 Australia Thin-film Encapsulation Market by Deposition Type
11.4.9.2 Australia Thin-film Encapsulation Market by Vertical
11.4.9.3 Australia Thin-film Encapsulation Market by Application
11.4.10 Rest of Asia-Pacific
11.4.10.1 APAC Thin-film Encapsulation Market by Deposition Type
11.4.10.2 APAC Thin-film Encapsulation Market by Vertical
11.4.10.3 APAC Thin-film Encapsulation Market by Application
11.5 The Middle East & Africa
11.5.1 The Middle East & Africa Thin-film Encapsulation Market by Country
11.5.2 The Middle East & Africa Thin-film Encapsulation Market by Deposition Type
11.5.3 The Middle East & Africa Thin-film Encapsulation Market by Vertical
11.5.4 The Middle East & Africa Thin-film Encapsulation Market by Application
11.5.6 Israel
11.5.6.1 Israel Thin-film Encapsulation Market by Deposition Type
11.5.6.2 Israel Thin-film Encapsulation Market by Vertical
11.5.6.3 Israel Thin-film Encapsulation Market by Application
11.5.6 UAE
11.5.6.1 UAE Thin-film Encapsulation Market by Deposition Type
11.5.6.2 UAE Thin-film Encapsulation Market by Vertical
11.5.6.3 UAE Thin-film Encapsulation Market by Application
11.5.7 South Africa
11.5.7.1 South Africa Thin-film Encapsulation Market by Deposition Type
11.5.7.2 South Africa Thin-film Encapsulation Market by Vertical
11.5.7.3 South Africa Thin-film Encapsulation Market by Application
11.5.8 Rest of Middle East & Africa
11.5.8.1 Rest of Middle East & Asia Thin-film Encapsulation Market by Deposition Type
11.5.8.2 Rest of Middle East & Asia Thin-film Encapsulation Market Power Rating
11.5.8.2 Rest of Middle East & Asia Thin-film Encapsulation Market by Application
11.6 Latin America
11.6.1 Latin America Thin-film Encapsulation Market by Country
11.6.2 Latin America Thin-film Encapsulation Market by Deposition Type
11.6.3 Latin America Thin-film Encapsulation Market by Vertical
11.6.4 Latin America Thin-film Encapsulation Market by Application
11.6.5 Brazil
11.6.5.1 Brazil Thin-film Encapsulation Market by Deposition Type
11.6.5.2Brazil Thin-film Encapsulation Market by Vertical
11.6.5.3 Brazil Thin-film Encapsulation Market by Application
11.6.6 Argentina
11.6.6.1 Argentina Thin-film Encapsulation Market by Deposition Type
11.6.6.2 Argentina Thin-film Encapsulation Market by Vertical
11.6.6.3 Argentina Thin-film Encapsulation Market by Application
11.6.7 Rest of Latin America
11.6.7.1 Rest of Latin America Thin-film Encapsulation Market by Deposition Type
11.6.7.2 Rest of Latin America Thin-film Encapsulation Market by Vertical
11.6.7.3 Rest of Latin America Thin-film Encapsulation Market by Application
12. Company Profile.
12.1 Samsung SDI Co., Ltd. (South Korea)
12.1.1 Market Overview
12.1.2 Financials
12.1.3 Product/Services/Offerings
12.1.4 SWOT Analysis
12.1.5 The SNS View
12.2 LG Chem (South Korea)
12.2.1 Market Overview
12.2.2 Financials
12.2.3 Product/Services/Offerings
12.2.4 SWOT Analysis
12.2.5 The SNS View
12.3 3M (US);
12.4.1 Market Overview
12.3.2 Financials
12.3.3 Product/Services/Offerings
12.3.4 SWOT Analysis
12.3.5 The SNS View
12.4 Toppan Inc.(Japan)
12.4.1 Market Overview
12.4.2 Financials
12.4.3 Product/Services/Offerings
12.4.4 SWOT Analysis
12.4.5 The SNS View
12.5 Ergis Group (Poland)
12.5.1 Market Overview
12.5.2 Financials
12.5.3 Product/Services/Offerings
12.5.4 SWOT Analysis
12.5.5 The SNS View
12.6 Veeco Instruments Inc. (US)
12.6.1 Market Overview
12.6.2 Financials
12.6.3 Product/Services/Offerings
12.6.4 SWOT Analysis
12.6.5 The SNS View
12.7 Universal Display Corporation (US)
12.7.1 Market Overview
12.7.2 Financials
12.7.3 Product/Services/Offerings
12.7.4 SWOT Analysis
12.7.5 The SNS View
12.8 Applied Materials, Inc. (US)
12.8.1 Market Overview
12.8.2 Financials
12.8.3 Product/Services/Offerings
12.8.4 SWOT Analysis
12.8.5 The SNS View
12.9 Kateeva (US)
12.9.1 Market Overview
12.9.2 Financials
12.9.3 Product/Services/Offerings
12.9.4 SWOT Analysis
12.9.5 The SNS View
12.10 Toray Industries, Inc. (Japan)
12.10.1 Market Overview
12.10.2 Financials
12.10.3 Product/Services/Offerings
12.10.4 SWOT Analysis
12.10.5 The SNS View
13. Competitive Landscape
13.1 Competitive Benchmarking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions
14. USE Cases and Best Practices
15. Conclucion
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