The Substrate-Like PCB Market was valued at USD 1.93 billion in 2023 and is expected to reach USD 6.57 billion by 2032, growing at a CAGR of 14.66% over the forecast period 2024-2032. Demand for compact, high-density circuitry in advanced electronics is causing increased fab utilization for the Substrate-Like PCB (SLP) market. Due to the need for accuracy and yield manufacturers are relying even more on automated optical and X-ray inspection technologies. Then, in the advanced laser drilling and mSAP processes for fine-line production perspective, we can look for equipment utilization. Further, chipset and 3D IC packaging integration is speeding up given that SLPs deliver the needed interconnect density and structure support for advanced heterogeneous integration and HPC applications. With the rising demand for high-density, compact circuitry in advanced electronics, the U.S. Substrate-Like PCB (SLP) market is expanding in 2024. Fine-line spacing below 25 µm is also a factor, in meeting the needs of compact devices. Now, some leading companies like TTM Technologies and AT&S are ahead of the game by taking a closer look at advanced manufacturing techniques that fulfill the increasing requirements of high-performance electronic applications.
The U.S. Substrate-Like PCB Market is estimated to be USD 0.40 Billion in 2023 and is projected to grow at a CAGR of 14.47%. The growth of the U.S. Substrate-Like PCB (SLP) market can be attributed to the demand for high-performance, high-density compact electronics in consumer electronic products and telecommunication systems. Photo courtesy of Next PCB. The development of 5G technology requires higher data transmission capacity for PCBs.
Key Drivers:
Surging Demand for Compact High-Performance Devices Fuels Rapid Growth of Substrate Like PCB Market
Growing demand for small-size, lightweight, and high-performance electronic automation & technology devices is the factor driving the growth of the Substrate-Like PCB (SLP) market. The expanding adoption of SLPs over the past three years in smartphones, particularly by leading smartphone OEMs such as Apple and Samsung because of the capability to carry high-density interconnects (HDI) as well as ideally and in design to enhance signal performance is poised to dramatically drive the market. In addition, the deployment of 5G, the proliferation of wearable technologies, and the continued incorporation of electronics in automobiles are driving demand for small-size, high-frequency PCBs. Improvements in inspection techniques such as Automated Optical Inspection (AOI) and Direct Imaging continue to improve production accuracy, further facilitating the widespread use of SLP usage.
Restrain:
Ultrafine Line Fabrication Challenges Restrict Substrates Like PCB Market Growth and Mass Production Efficiency
Technological complexity in the manufacturing of ultrafine line and space PCBs is one of the major restraints to the growth of the substrate-like PCB (SLP) market. This fabrication is characterized by a high degree of precision, and complex technologies, resulting in low manufacturing yields and prolonged development times for sub-25/25 µm designs as well as difficulties in achieving consistency during mass production, due to the critical impact of even minor defects on functionality. This creates a barrier to entry for many smaller manufacturers or new entrants, hindering market growth.
Opportunity:
Rising EVs Medical Devices and Smart Manufacturing Unlock Opportunities for Substrate Like PCB Market
The trend towards the scaling up of EVs and autonomous driving increases the need for smaller and more reliable electronic components in automotive systems, therefore providing a significant opportunity for the surface mount packages (SLP) market. Future demand is also expected to be propelled by novel applications in the medical industry like implantable and wearable diagnostic devices (20). Further, the drive towards system automation and smart manufacturing drives to need for high-level PCB in industrial automation and robotics. This demand for ultra-fine line PCBs (<25/25 µm), unlocks additional opportunities for ultra-fine line manufacturers, targeting high-precision electronics and next-gen semiconductor packaging solutions.
Challenges:
Skilled Labor Shortage and Integration Challenges Hinder Substrate Like PCB Adoption and Development Speed
The other big problem is the shortage of labor and technical skills needed to handle machines such as direct imaging systems and automated optical shaping machines. In regions where advanced electronics manufacturing is still maturing, this expertise gap can also slow down the adoption rate of SLP technologies. In addition, SLPs can have challenges for OEMs regarding the integration of transitioning through traditional PCB assembly processes due to potential compatibility issues. End-user applications in certain areas, such as automotive and healthcare, continue to evolve at a rapid pace, requiring SLP manufacturers to remain agile to comply with ever-stricter regulatory and performance specifications which only complicates product development and time-to-market strategies.
By Line
The 25/25 & 30/30 µm segment led in the Substrate-Like PCB (SLP) share at 66.3% globally. It predominantly rules this area, thanks to constant usage and growth in consumer electronics such as smartphones and tablets, thanks to the balance it provides between performance, manufacturability, and cost-efficiency. Such line/space resolutions are mature, already well integrated into existing profusion lines, and far exceed the needs of most current-generation devices.
The segment below 25/25 µm is expected to grow at the fastest CAGR of 25.6% from 2024 to 2032. It can also be attributed to the growing need for high-density interconnects that are miniaturized for newer applications like 5 G-enabled devices, foldable smartphones, wearables, and next-gen automotive electronics. Industrial applications requiring ultra-fine patterning and high circuit density, as consumer devices become slimmer and gain added functionality, are providing robust growth potential in this segment. This will be accompanied by similar growth due to the continued innovation of direct imaging and laser drilling technologies.
By Inspection Technology
Automated Optical Inspection (AOI) had the largest share of the SLP market in 2023, accounting for 53.3%. AOI is a widely used technology that is very effective for capturing defects like shorts, opens, and misalignments in the early stages of the production process. Used at various stages in PCB manufacturing, it allows for consistent quality control and yield enhancement, making it an ideal inspection approach to be used across large-scale production lines, especially in consumer electronics manufacturing.
Direct Imaging is likely to be the fastest-growing segment with a CAGR during the forecast period (2024–2032) Such photomask-free technology with better resolution and alignment capabilities are essential for the manufacturing of the ultra-fine line PCBs (e.g.< 25/25 µm) Direct Imaging Adoption: There is an increasing demand for miniaturization and higher density in circuit design – specifically for applications in 5G devices, IoT, and automotive electronics. This characteristic combined with its high precision makes it the perfect choice for future SLP production.
By Application
Consumer Electronics held the highest share 56.3% of the Substrate-Like PCB (SLP) market in 2023. The ubiquity of SLP integration in smartphones, tablets, smartwatches, and other portable devices has driven this dominance. SLPs have been used by major electronics manufacturers likes as Apple and Samsung to facilitate high-density interconnects that allow for thinner, lighter, and more powerful devices. This also continues to drive consumers in this segment, given the demand for compact and feature-rich electronics continues to grow.
The Automotive segment is anticipated to record the highest CAGR from 2024 to 2032 Increased penetration of EVs, ADAS/AD solutions connected car systems are fueling the need for sophisticated electronic architectures. Automotive use cases like ADAS, infotainment, and power management require reliable features with miniaturization and signal performance characteristics that SLPs offer. With more intelligent, electronic-heavy vehicles, we are experiencing a high-growth segment for high-performance PCBs primarily SLPs in the automotive sector.
Asia Pacific was the largest Substrate-Like PCB (SLP) market, with a share of 35.4% in 2023, and is expected to maintain the highest growth rate during the forecast period, from 2024 to 2032. This growth is driven by the strong manufacturing ecosystem of the region, increased demand for consumer electronics, and the swift adoption of advanced technologies. China, South Korea, Taiwan, and Japan have evolved to be the epicenters of manufacturing in the world while the leading manufacturers Unimicron, Ibiden, and Samsung Electro-Mechanics have established themselves there. They are pioneering innovation and industrialization of these SLPs for adoption in premium smartphones and tablets and other new tech that incorporates 5G / Internet of Things capabilities. For example, SLPs are sourced from multiple suppliers in Asia by Apple for its iPhone models, whereas in the case of the Galaxy series by Samsung, in-house capabilities are utilized. Also, the expanded EV market in China and the development of automotive electronics in Japan and South Korea have boosted the penetration of SLPs for automotive applications. Asia Pacific remains the hub for SLP development and adoption led by strong government initiatives supporting semiconductor and electronics manufacturing, highly-skilled labor, and matured infrastructure.
Zhen Ding Technology (SLP for iPhone),
Compeq Manufacturing (High-Density SLP Boards),
Unimicron Technology (SLP for Smartphones),
AT&S (Advanced SLP Interconnects),
Shennan Circuits (SLP for 5G Modules),
Ibiden Co., Ltd. (SLP for Mobile Devices),
Kinsus Interconnect Technology (SLP Substrate),
TTM Technologies (HDI/SLP Boards),
Samsung Electro-Mechanics (SLP for Galaxy Series),
Tripod Technology Corporation (SLP for Wearables),
Daeduck Electronics (Advanced SLP Layers),
LG Innotek (SLP for Camera Modules),
Meiko Electronics (SLP for Automotive Applications),
Nan Ya PCB Corporation (SLP for Communication Devices),
Fujikura Ltd. (SLP for Electronic Modules)
In October 2024, DuPont and Zhen Ding Technology Group signed a strategic cooperation agreement to advance high-end PCB technology, focusing on innovation, smart manufacturing, and sustainability.
In June 2024, LG Innotek began mass production of FC-BGA substrates for major U.S. tech firms like Intel and NVIDIA, marking its entry into the AI and high-performance computing market.
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | USD 1.93 Billion |
| Market Size by 2032 | USD 6.57 Billion |
| CAGR | CAGR of 14.66% From 2024 to 2032 |
| Base Year | 2023 |
| Forecast Period | 2024-2032 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Line (25/25 & 30/30 ìm, Less than 25/25 ìm) • By Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping) • By Application (Consumer Electronics, Computing & Telecommunications, Automotive, Medical, Industrial, Military, Defense, & Aerospace) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia, Rest of Latin America) |
| Company Profiles | Zhen Ding Technology, Compeq Manufacturing, Unimicron Technology, AT&S, Shennan Circuits, Ibiden Co., Ltd., Kinsus Interconnect Technology, TTM Technologies, Samsung Electro-Mechanics, Tripod Technology Corporation, Daeduck Electronics, LG Innotek, Meiko Electronics, Nan Ya PCB Corporation, Fujikura Ltd. |
Ans: The Substrate-Like PCB Market is expected to grow at a CAGR of 14.66% during 2024-2032.
Ans: Substrate-Like PCB Market size was USD 1.93 billion in 2023 and is expected to Reach USD 6.57 billion by 2032.
Ans: The major growth factor of the Substrate-Like PCB market is the rising demand for high-density, miniaturized PCBs in advanced consumer electronics and AI-powered devices.
Ans: The 25/25 & 30/30 ìm segment dominated the Substrate-Like PCB Market in 2023.
Ans: Asia Pacific dominated the Substrate-Like PCB Market in 2023.
Table of Content
1. Introduction
1.1 Market Definition
1.2 Scope (Inclusion and Exclusions)
1.3 Research Assumptions
2. Executive Summary
2.1 Market Overview
2.2 Regional Synopsis
2.3 Competitive Summary
3. Research Methodology
3.1 Top-Down Approach
3.2 Bottom-up Approach
3.3. Data Validation
3.4 Primary Interviews
4. Market Dynamics Impact Analysis
4.1 Market Driving Factors Analysis
4.1.1 Drivers
4.1.2 Restraints
4.1.3 Opportunities
4.1.4 Challenges
4.2 PESTLE Analysis
4.3 Porter’s Five Forces Model
5. Statistical Insights and Trends Reporting
5.1 Fab/Manufacturing Utilization Trend
5.2 Inspection Technology Adoption
5.3 Equipment Utilization Insight
5.4 Integration with Chiplets & 3D IC Packaging
6. Competitive Landscape
6.1 List of Major Companies, By Region
6.2 Market Share Analysis, By Region
6.3 Product Benchmarking
6.3.1 Product specifications and features
6.3.2 Pricing
6.4 Strategic Initiatives
6.4.1 Marketing and Promotional Activities
6.4.2 Distribution and Supply Chain Strategies
6.4.3 Expansion plans and new product launches
6.4.4 Strategic partnerships and collaborations
6.5 Technological Advancements
6.6 Market Positioning and Branding
7. Substrate-Like PCB Market Segmentation, By Line
7.1 Chapter Overview
7.2 25/25 & 30/30 ìm
7.2.1 25/25 & 30/30 ìm Market Trends Analysis (2020-2032)
7.2.2 25/25 & 30/30 ìm Market Size Estimates and Forecasts to 2032 (USD Billion)
7.3 Less than 25/25 ìm
7.3.1 Less than 25/25 ìm Market Trends Analysis (2020-2032)
7.3.2 Less than 25/25 ìm Market Size Estimates and Forecasts to 2032 (USD Billion)
8. Substrate-Like PCB Market Segmentation, By Inspection Technology
8.1 Chapter Overview
8.2 Automated Optical Inspection
8.2.1 Automated Optical Inspection Market Trends Analysis (2020-2032)
8.2.2 Automated Optical Inspection Market Size Estimates and Forecasts to 2032 (USD Billion)
8.3 1 Direct Imaging
8.3.1 Direct Imaging Market Trends Analysis (2020-2032)
8.3.2 Direct Imaging Market Size Estimates and Forecasts to 2032 (USD Billion)
8.4 Automated Optical Shaping
8.4.1 Automated Optical Shaping Market Trends Analysis (2020-2032)
8.4.2 Automated Optical Shaping Market Size Estimates and Forecasts to 2032 (USD Billion)
9. Substrate-Like PCB Market Segmentation, By Application
9.1 Chapter Overview
9.2 Consumer Electronics
9.2.1 Consumer Electronics Market Trends Analysis (2020-2032)
9.2.2 Consumer Electronics Market Size Estimates and Forecasts to 2032 (USD Billion)
9.3 Computing & Telecommunications
9.3.1 Computing & Telecommunications Market Trends Analysis (2020-2032)
9.3.2 Computing & Telecommunications Market Size Estimates and Forecasts to 2032 (USD Billion)
9.4 Automotive
9.4.1 Automotive Market Trends Analysis (2020-2032)
9.4.2 Automotive Market Size Estimates and Forecasts to 2032 (USD Billion)
9.5 Medical
9.5.1 Medical Market Trends Analysis (2020-2032)
9.5.2 Medical Market Size Estimates and Forecasts to 2032 (USD Billion)
9.6 Industrial
9.6.1 Industrial Market Trends Analysis (2020-2032)
9.6.2 Industrial Market Size Estimates and Forecasts to 2032 (USD Billion)
9.7 Military, Defense, & Aerospace
9.7.1 Military, Defense, & Aerospace Market Trends Analysis (2020-2032)
9.7.2 Military, Defense, & Aerospace Market Size Estimates and Forecasts to 2032 (USD Billion)
10. Regional Analysis
10.1 Chapter Overview
10.2 North America
10.2.1 Trends Analysis
10.2.2 North America Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.2.3 North America Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.2.4 North America Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.2.5 North America Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.2.6 USA
10.2.6.1 USA Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.2.6.2 USA Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.2.6.3 USA Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.2.7 Canada
10.2.7.1 Canada Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.2.7.2 Canada Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.2.7.3 Canada Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.2.8 Mexico
10.2.8.1 Mexico Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.2.8.2 Mexico Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.2.8.3 Mexico Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3 Europe
10.3.1 Eastern Europe
10.3.1.1 Trends Analysis
10.3.1.2 Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.3.1.3 Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.4 Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.5 Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.1.6 Poland
10.3.1.6.1 Poland Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.6.2 Poland Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.6.3 Poland Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.1.7 Romania
10.3.1.7.1 Romania Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.7.2 Romania Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.7.3 Romania Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.1.8 Hungary
10.3.1.8.1 Hungary Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.8.2 Hungary Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.8.3 Hungary Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.1.9 Turkey
10.3.1.9.1 Turkey Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.9.2 Turkey Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.9.3 Turkey Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.1.10 Rest of Eastern Europe
10.3.1.10.1 Rest of Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.1.10.2 Rest of Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.1.10.3 Rest of Eastern Europe Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2 Western Europe
10.3.2.1 Trends Analysis
10.3.2.2 Western Europe Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.3.2.3 Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.4 Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.5 Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.6 Germany
10.3.2.6.1 Germany Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.6.2 Germany Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.6.3 Germany Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.7 France
10.3.2.7.1 France Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.7.2 France Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.7.3 France Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.8 UK
10.3.2.8.1 UK Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.8.2 UK Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.8.3 UK Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.9 Italy
10.3.2.9.1 Italy Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.9.2 Italy Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.9.3 Italy Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.10 Spain
10.3.2.10.1 Spain Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.10.2 Spain Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.10.3 Spain Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.11 Netherlands
10.3.2.11.1 Netherlands Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.11.2 Netherlands Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.11.3 Netherlands Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.12 Switzerland
10.3.2.12.1 Switzerland Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.12.2 Switzerland Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.12.3 Switzerland Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.13 Austria
10.3.2.13.1 Austria Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.13.2 Austria Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.13.3 Austria Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.3.2.14 Rest of Western Europe
10.3.2.14.1 Rest of Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.3.2.14.2 Rest of Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.3.2.14.3 Rest of Western Europe Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4 Asia Pacific
10.4.1 Trends Analysis
10.4.2 Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.4.3 Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.4 Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.5 Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.6 China
10.4.6.1 China Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.6.2 China Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.6.3 China Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.7 India
10.4.7.1 India Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.7.2 India Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.7.3 India Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.8 Japan
10.4.8.1 Japan Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.8.2 Japan Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.8.3 Japan Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.9 South Korea
10.4.9.1 South Korea Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.9.2 South Korea Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.9.3 South Korea Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.10 Vietnam
10.4.10.1 Vietnam Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.10.2 Vietnam Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.10.3 Vietnam Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.11 Singapore
10.4.11.1 Singapore Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.11.2 Singapore Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.11.3 Singapore Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.12 Australia
10.4.12.1 Australia Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.12.2 Australia Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.12.3 Australia Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.4.13 Rest of Asia Pacific
10.4.13.1 Rest of Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.4.13.2 Rest of Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.4.13.3 Rest of Asia Pacific Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5 Middle East and Africa
10.5.1 Middle East
10.5.1.1 Trends Analysis
10.5.1.2 Middle East Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.5.1.3 Middle East Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.4 Middle East Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.5 Middle East Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.1.6 UAE
10.5.1.6.1 UAE Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.6.2 UAE Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.6.3 UAE Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.1.7 Egypt
10.5.1.7.1 Egypt Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.7.2 Egypt Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.7.3 Egypt Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.1.8 Saudi Arabia
10.5.1.8.1 Saudi Arabia Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.8.2 Saudi Arabia Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.8.3 Saudi Arabia Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.1.9 Qatar
10.5.1.9.1 Qatar Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.9.2 Qatar Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.9.3 Qatar Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.1.10 Rest of Middle East
10.5.1.10.1 Rest of Middle East Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.1.10.2 Rest of Middle East Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.1.10.3 Rest of Middle East Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.2 Africa
10.5.2.1 Trends Analysis
10.5.2.2 Africa Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.5.2.3 Africa Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.2.4 Africa Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.2.5 Africa Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.2.6 South Africa
10.5.2.6.1 South Africa Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.2.6.2 South Africa Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.2.6.3 South Africa Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.2.7 Nigeria
10.5.2.7.1 Nigeria Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.2.7.2 Nigeria Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.2.7.3 Nigeria Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.5.2.8 Rest of Africa
10.5.2.8.1 Rest of Africa Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.5.2.8.2 Rest of Africa Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.5.2.8.3 Rest of Africa Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.6 Latin America
10.6.1 Trends Analysis
10.6.2 Latin America Substrate-Like PCB Market Estimates and Forecasts, by Country (2020-2032) (USD Billion)
10.6.3 Latin America Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.6.4 Latin America Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.6.5 Latin America Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.6.6 Brazil
10.6.6.1 Brazil Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.6.6.2 Brazil Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.6.6.3 Brazil Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.6.7 Argentina
10.6.7.1 Argentina Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.6.7.2 Argentina Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.6.7.3 Argentina Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.6.8 Colombia
10.6.8.1 Colombia Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.6.8.2 Colombia Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.6.8.3 Colombia Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
10.6.9 Rest of Latin America
10.6.9.1 Rest of Latin America Substrate-Like PCB Market Estimates and Forecasts, By Line (2020-2032) (USD Billion)
10.6.9.2 Rest of Latin America Substrate-Like PCB Market Estimates and Forecasts, By Inspection Technology (2020-2032) (USD Billion)
10.6.9.3 Rest of Latin America Substrate-Like PCB Market Estimates and Forecasts, By Application (2020-2032) (USD Billion)
11. Company Profiles
11.1 Zhen Ding Technology.
11.1.1 Company Overview
11.1.2 Financial
11.1.3 Products/ Services Offered
11.1.4 SWOT Analysis
11.2 Compeq Manufacturing.
11.2.1 Company Overview
11.2.2 Financial
11.2.3 Products/ Services Offered
11.2.4 SWOT Analysis
11.3 Unimicron Technology.
11.3.1 Company Overview
11.3.2 Financial
11.3.3 Products/ Services Offered
11.3.4 SWOT Analysis
11.4 AT&S.
11.4.1 Company Overview
11.4.2 Financial
11.4.3 Products/ Services Offered
11.4.4 SWOT Analysis
11.5 Shennan Circuits.
11.5.1 Company Overview
11.5.2 Financial
11.5.3 Products/ Services Offered
11.5.4 SWOT Analysis
11.6 Ibiden Co., Ltd
11.6.1 Company Overview
11.6.2 Financial
11.6.3 Products/ Services Offered
11.6.4 SWOT Analysis
11.7 Kinsus Interconnect Technology.
11.7.1 Company Overview
11.7.2 Financial
11.7.3 Products/ Services Offered
11.7.4 SWOT Analysis
11.8 TTM Technologies.
11.8.1 Company Overview
11.8.2 Financial
11.8.3 Products/ Services Offered
11.8.4 SWOT Analysis
11.9 Samsung Electro-Mechanics
11.9.1 Company Overview
11.9.2 Financial
11.9.3 Products/ Services Offered
11.9.4 SWOT Analysis
11.10 Tripod Technology Corporation
11.10.1 Company Overview
11.10.2 Financial
11.10.3 Products/ Services Offered
11.10.4 SWOT Analysis
12. Use Cases and Best Practices
13. Conclusion
An accurate research report requires proper strategizing as well as implementation. There are multiple factors involved in the completion of good and accurate research report and selecting the best methodology to compete the research is the toughest part. Since the research reports we provide play a crucial role in any company’s decision-making process, therefore we at SNS Insider always believe that we should choose the best method which gives us results closer to reality. This allows us to reach at a stage wherein we can provide our clients best and accurate investment to output ratio.
Each report that we prepare takes a timeframe of 350-400 business hours for production. Starting from the selection of titles through a couple of in-depth brain storming session to the final QC process before uploading our titles on our website we dedicate around 350 working hours. The titles are selected based on their current market cap and the foreseen CAGR and growth.
The 5 steps process:
Step 1: Secondary Research:
Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.
Step 2: Primary Research
When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data. This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.
We at SNS Insider have divided Primary Research into 2 parts.
Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.
This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.
Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.
Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.
Step 3: Data Bank Validation
Once all the information is collected via primary and secondary sources, we run that information for data validation. At our intelligence centre our research heads track a lot of information related to the market which includes the quarterly reports, the daily stock prices, and other relevant information. Our data bank server gets updated every fortnight and that is how the information which we collected using our primary and secondary information is revalidated in real time.
Step 4: QA/QC Process
After all the data collection and validation our team does a final level of quality check and quality assurance to get rid of any unwanted or undesired mistakes. This might include but not limited to getting rid of the any typos, duplication of numbers or missing of any important information. The people involved in this process include technical content writers, research heads and graphics people. Once this process is completed the title gets uploader on our platform for our clients to read it.
Step 5: Final QC/QA Process:
This is the last process and comes when the client has ordered the study. In this process a final QA/QC is done before the study is emailed to the client. Since we believe in giving our clients a good experience of our research studies, therefore, to make sure that we do not lack at our end in any way humanly possible we do a final round of quality check and then dispatch the study to the client.
Key Segments:
By Line
25/25 & 30/30 ìm
Less than 25/25 ìm
By Inspection Technology
Automated Optical Inspection
Direct Imaging
Automated Optical Shaping
By Application
Consumer Electronics
Computing & Telecommunications
Automotive
Medical
Industrial
Military, Defense, & Aerospace
Request for Segment Customization as per your Business Requirement: Segment Customization Request
Regional Coverage:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Rest of Latin America
Request for Country Level Research Report: Country Level Customization Request
Available Customization
With the given market data, SNS Insider offers customization as per the company’s specific needs. The following customization options are available for the report:
Detailed Volume Analysis
Criss-Cross segment analysis (e.g. Product X Application)
Competitive Product Benchmarking
Geographic Analysis
Additional countries in any of the regions
Customized Data Representation
Detailed analysis and profiling of additional market players
The Battery-free Sensors Market Size was valued at USD 41.46 Million in 2023 and is expected to grow at a CAGR of 25.21% to reach USD 313.64 Million by 2032
The Touch Screen Display Market Size was valued at USD 76.36 billion in 2023 and is expected to grow at a CAGR of 10.95% to reach USD 194.44 billion by 2032.
The Rugged Electronics Market Size was valued at USD 14.01 Billion in 2023 and is expected to grow to USD 26.4 Billion at a CAGR of 7.32% During 2024-2032
The Wireless Charging IC Market Size was valued at USD 3.32 Billion in 2023 and is expected to grow at a CAGR of 22.4% to reach USD 20.36 Billion by 2032.
The Machine Automation Controller Market was valued at USD 42.08 billion in 2023 and is expected to reach USD 61.66 billion by 2032, growing at a CAGR of 4.39% over the forecast period 2024-2032
The Home Audio Equipment Market was USD 1.50 Billion in 2023 and is expected to reach USD 2.35 Billion by 2032, growing at a CAGR of 5.15% by 2024-2032.
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