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The SiC Device Power market size was valued at USD 1.916 Billion in 2023 and is expected to grow to USD 12.89 Billion by 2032 and grow at a CAGR Of 23.6% over the forecast period of 2024-2032.
The term "SiC power semiconductor" describes a class of semiconductor that performs at extremely high voltages and temperatures and contains silicon and carbon. The viability of SiC devices has been demonstrated for a wide range of device types, and work has begun on developing a production technique with the main concerns right now being yield, reliability, and cost.
It is now extremely challenging to enter the device market using SiC on an economically viable basis due to the high substrate prices that keep SiC manufacturing costs high. Prime applications are those for which SiC provides significant advantages or even a system-level technical advance. The primary application is power conversion, where the most recent advances in silicon-based power switches (such as IGBT) enable the use of much higher switching frequencies, placing extremely high demands on the free-wheeling diode. The diode recovery to a considerable extent limits the system performance.
KEY DRIVERS:
Growing demand for SiC power devices in the automotive industry
Increasing the use of silicon in power electronics
Increasing adaption of Sic semiconductor
As a semiconductor material, SiC has many advantageous characteristics. Silicon carbide (SiC) devices have various benefits in applications including inverters, motor drives, and battery chargers, including higher power density, less cooling needs, and decreased total system cost.
RESTRAIN:
High Cost
OPPORTUNITY:
Focusing on solar power system
SiC uses for developing sustainable energy
Sic Manufacturers' Strategic Partnership and Acquisition,
This collaboration significantly boosts the development of the global SiC power semiconductor market.
CHALLENGES:
Innovations in Sic Semiconductor
The availability of replacement materials like gallium nitride
Manufacturing-Related SiC wafers issue
The semiconductor material known as ASIC wafer offers superior electrical and thermal properties. It has a very high level of hardness in addition to having a good thermal resistance. The manufacturing of SiC wafers has numerous fabrication challenges.
IMPACT ANALYSIS
It's possible that the semiconductor shortfall, which was anticipated to lessen by mid-2022, will worsen. Russia attacking Ukraine will put further burden on the industry globally because both Russia and Ukraine are suppliers of components needed in semiconductor manufacture. There are concerns that this could lead to manufacturing constraints that would cause supply shortages and semiconductor price increases.
Ukraine is a prominent supplier and source of raw materials, such as the semiconductor-grade neon used in the production of semiconductors. Russia is also a significant supplier of the palladium used in numerous memory and sensor chips. In actuality, it makes up 45% of the world's supply.
IMPACT OF ONGOING RECESSION
The semiconductor industry, which is still recovering from the recession, is nevertheless feeling its effects. Smaller firms have struggled due to a lack of resources, but many larger enterprises have been able to weather the storm. As a result, some companies have shifted their focus from traditional semiconductor products to more modern ones like MEMS (Micro-Electro-Mechanical Systems) and 3D printing. The semiconductor industry has been severely impacted by the most recent economic slump. Many enterprises were compelled to carry out significant layoffs, and others were even compelled to close down entirely.
By Component
Schottky Diodes
FET/MOSFET Transistors
Rectifiers/Diodes
Power Modules
Others
By Product
Optoelectronic Devices
Power Semiconductors
Frequency Devices
By Wafer Size
1 inch to 4 inches
6 inches
8 inches
10 inches & above
By End-user
Automotive
Electric Vehicles
IC Automobiles
Consumer Electronics
Aerospace & Defense
Medical Devices
Data & Communication Devices
Energy & Power
EV Infrastructure
Power Distribution & Utilities
Others
Due to the strong demand for SiC power semiconductors, the Asia-Pacific region is anticipated to lead the global SiC power semiconductor market in 2023 semiconductors. The increased demand for power modules and related devices is also anticipated to fuel the market's expansion.
In 2021, Asia Pacific held a commanding market share of more than 30% for SiC semiconductor devices. Leading market players are anticipated to fuel the market's expansion in the Asia Pacific region. The market expansion in Asia Pacific is also influenced by the rising investments made in research and development and manufacturing throughout the region. For instance, Toshiba Electronic Components and Storage Co., Ltd. said in March 2022 that it will invest JPY 100 billion (USD 839 million) to increase the capacity of its power component manufacturing.
The presence and concentration of notable firms as Gene Sic Semiconductor and ON SEMICONDUCTOR CORPORATION (on semi), who have a sizable client base, are responsible for the region's success in North America.
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REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Rest of Latin America
The Major Players are ALLEGRO MICROSYSTEMS, INC., Infineon Technologies AG, ROHM Co., Ltd., STMicroelectronics N.V., ON SEMICONDUCTOR CORPORATION (on semi), WOLFSPEED, INC., Gene Sic Semiconductor, TT Electronics plc., Mitsubishi Electric Corporation, Powerex Inc., Toshiba Corporation, FUJI ELECTRIC CO., LTD. And other players are listed in a final report.
To expand the manufacture of silicon carbide (SiC) power semiconductors, Mitsubishi Electric Corporation said in March 2023 that it would quadruple its investment, to USD 2 billion, for the construction of a new wafer facility in the Shisui region of Kumamoto Prefecture. The 8-inch SiC wafer plant will be produced at this new facility
In order to provide next-generation mobility, WOLFSPEED, INC. teamed with ZF, a leading global technology business, in February 2023. Through this collaboration, Silicon Carbide systems and devices will be developed for use in energy, industrial, and transportation applications. Additionally, a state-of-the-art and sizable 200mm Silicon Carbide device fab is being built in Ensdorf, Germany.
WOLFSPEED, INC. introduced the Gen 3+ 750 V bare-die MOSFET in January 2023. The layout of this product is 5mm x smm180 mm in height. To reduce switching losses and maximize current rise time, it has a low internal gate resistance Rg. Significantly, the new device has a high maximum junction temperature (TJ) and a low on-state resistance (RDS(ON)).
In December 2022. With a top manufacturer of power devices, WOLFSPEED, INC. extended its multi-year, long-term contract for the supply of silicon carbide wafers. With this deal, Wolfspeed will support the business's goal of an industry-wide switch from silicon-to-Silicon Carbide semiconductor power devices by providing 150 mm Silicon Carbide pare and epitaxial wafers.
| Report Attributes | Details |
| Market Size in 2023 | USD 1.91 Bn |
| Market Size by 2032 | USD 12.89 Bn |
| CAGR | CAGR of 23.9 % From 2024 to 2032 |
| Base Year | 2022 |
| Forecast Period | 2024-2032 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Component (Schottky Diodes, FET/MOSFET Transistors, Integrated Circuits, Rectifiers/Diodes, Power Modules, Others) • By Product (Optoelectronic Devices, Power Semiconductors, Frequency Devices) • By Wafer Size (1 inch to 4 inches, 6 inches, 8 inches, 10 inches & above) • By End-user (Automotive, Consumer Electronics, Aerospace & Defense, Medical Devices, Data & Communication Devices, Energy & Power, Others) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]). Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia Rest of Latin America) |
| Company Profiles | ALLEGRO MICROSYSTEMS, INC., Infineon Technologies AG, ROHM Co., Ltd., STMicroelectronics N.V., ON SEMICONDUCTOR CORPORATION (on semi), WOLFSPEED, INC., Gene Sic Semiconductor, TT Electronics plc., Mitsubishi Electric Corporation, Powerex Inc., Toshiba Corporation, FUJI ELECTRIC CO., LTD. |
| Key Drivers | • Growing demand for SiC power devices in the automotive industry • Increasing the use of silicon in power electronics • Increasing adaption of Sic semiconductor |
| Market Restraints | • High Cost |
Ans: SiC Power Device Market is anticipated to expand by 23.6% from 2024 to 2032.
Ans: USD 12.89 Billion is expected to grow by 2032.
Ans: SiC Power Device Market size was valued at USD 1.91 Billion in 2023
Ans: Acia Pacific is dominating the market.
Ans: Technological Advancement, Development in electric vehicle and autonomous technology, Need for expanding driver safety and comfort in vehicle
TABLE OF CONTENTS
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 Impact of the Ukraine- Russia war
4.2 Impact of ongoing Recession
4.2.1 Introduction
4.2.2 Impact on major economies
4.2.2.1 US
4.2.2.2 Canada
4.2.2.3 Germany
4.2.2.4 France
4.2.2.5 United Kingdom
4.2.2.6 China
4.2.2.7 Japan
4.2.2.8 South Korea
4.2.2.9 Rest of the World
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. SiC Power Device Market Segmentation, By Component
8.1 Schottky Diodes
8.2 FET/MOSFET Transistors
8.3 Integrated Circuits
8.4 Rectifiers/Diodes
8.5 Power Modules
8.6 Others
9. SiC Power Device Market Segmentation, By Product
9.1 Optoelectronic Devices
9.2 Power Semiconductors
9.3 Frequency Devices
10. SiC Power Device Market Segmentation, By Wafer Size
10.1 1 inch to 4 inches
10.2 6 inches
10.3 8 inches
10.4 10 inches & above
11. SiC Power Device Market Segmentation, By End-user
11.1 Automotive
11.1.1 Electric Vehicles
11.1.2 IC Automobiles
11.2 Consumer Electronics
11.3 Aerospace & Defense
11.4 Medical Devices
11.5 Data & Communication Devices
11.6 Energy & Power
11.6.1 EV Infrastructure
11.6.2 Power Distribution & Utilities
11.7 Others
12. Regional Analysis
12.1 Introduction
12.2 North America
12.2.1 North America SiC Power Device Market by Country
12.2.2North America SiC Power Device Market by Component
12.2.3 North America SiC Power Device Market by Product Type
12.2.4 North America SiC Power Device Market by Wafer Size
12.2.5 North America SiC Power Device Market by End User
12.2.6 USA
12.2.6.1 USA SiC Power Device Market by Component
12.2.6.2 USA SiC Power Device Market by Product Type
12.2.6.3 USA SiC Power Device Market by Wafer Size
12.2.6.4 USA SiC Power Device Market by End User
12.2.7 Canada
12.2.7.1 Canada SiC Power Device Market by Component
12.2.7.2 Canada SiC Power Device Market by Product Type
12.2.7.3 Canada SiC Power Device Market by Wafer Size
12.2.7.4 Canada SiC Power Device Market by End User
12.2.8 Mexico
12.2.8.1 Mexico SiC Power Device Market by Component
12.2.8.2 Mexico SiC Power Device Market by Product Type
12.2.8.3 Mexico SiC Power Device Market by Wafer Size
12.2.8.4 Mexico SiC Power Device Market by End User
12.3 Europe
12.3.1 Eastern Europe
12.3.1.1 Eastern Europe SiC Power Device Market by Country
12.3.1.2 Eastern Europe SiC Power Device Market by Component
12.3.1.3 Eastern Europe SiC Power Device Market by Product Type
12.3.1.4 Eastern Europe SiC Power Device Market by Wafer Size
12.3.1.5 Eastern Europe SiC Power Device Market by End User
12.3.1.6 Poland
12.3.1.6.1 Poland SiC Power Device Market by Component
12.3.1.6.2 Poland SiC Power Device Market by Product Type
12.3.1.6.3 Poland SiC Power Device Market by Wafer Size
12.3.1.6.4 Poland SiC Power Device Market by End User
12.3.1.7 Romania
12.3.1.7.1 Romania SiC Power Device Market by Component
12.3.1.7.2 Romania SiC Power Device Market by Product Type
12.3.1.7.3 Romania SiC Power Device Market by Wafer Size
12.3.1.7.4 Romania SiC Power Device Market by End User
12.3.1.8 Hungary
12.3.1.8.1 Hungary SiC Power Device Market by Component
12.3.1.8.2 Hungary SiC Power Device Market by Product Type
12.3.1.8.3 Hungary SiC Power Device Market by Wafer Size
12.3.1.8.4 Hungary SiC Power Device Market by End User
12.3.1.9 Turkey
12.3.1.9.1 Turkey SiC Power Device Market by Component
12.3.1.9.2 Turkey SiC Power Device Market by Product Type
12.3.1.9.3 Turkey SiC Power Device Market by Wafer Size
12.3.1.9.4 Turkey SiC Power Device Market by End User
12.3.1.10 Rest of Eastern Europe
12.3.1.10.1 Rest of Eastern Europe SiC Power Device Market by Component
12.3.1.10.2 Rest of Eastern Europe SiC Power Device Market by Product Type
12.3.1.10.3 Rest of Eastern Europe SiC Power Device Market by Wafer Size
12.3.1.10.4 Rest of Eastern Europe SiC Power Device Market by End User
12.3.2 Western Europe
12.3.2.1 Western Europe SiC Power Device Market by Country
12.3.2.2 Western Europe SiC Power Device Market by Component
12.3.2.3 Western Europe SiC Power Device Market by Product Type
12.3.2.4 Western Europe SiC Power Device Market by Wafer Size
12.3.2.5 Western Europe SiC Power Device Market by End User
12.3.2.6 Germany
12.3.2.6.1 Germany SiC Power Device Market by Component
12.3.2.6.2 Germany SiC Power Device Market by Product Type
12.3.2.6.3 Germany SiC Power Device Market by Wafer Size
12.3.2.6.4 Germany SiC Power Device Market by End User
12.3.2.7 France
12.3.2.7.1 France SiC Power Device Market by Component
12.3.2.7.2 France SiC Power Device Market by Product Type
12.3.2.7.3 France SiC Power Device Market by Wafer Size
12.3.2.7.4 France SiC Power Device Market by End User
12.3.2.8 UK
12.3.2.8.1 UK SiC Power Device Market by Component
12.3.2.8.2 UK SiC Power Device Market by Product Type
12.3.2.8.3 UK SiC Power Device Market by Wafer Size
12.3.2.8.4 UK SiC Power Device Market by End User
12.3.2.9 Italy
12.3.2.9.1 Italy SiC Power Device Market by Component
12.3.2.9.2 Italy SiC Power Device Market by Product Type
12.3.2.9.3 Italy SiC Power Device Market by Wafer Size
12.3.2.9.4 Italy SiC Power Device Market by End User
12.3.2.10 Spain
12.3.2.10.1 Spain SiC Power Device Market by Component
12.3.2.10.2 Spain SiC Power Device Market by Product Type
12.3.2.10.3 Spain SiC Power Device Market by Wafer Size
12.3.2.10.4 Spain SiC Power Device Market by End User
12.3.2.11 Netherlands
12.3.2.11.1 Netherlands SiC Power Device Market by Component
12.3.2.11.2 Netherlands SiC Power Device Market by Product Type
12.3.2.11.3 Netherlands SiC Power Device Market by Wafer Size
12.3.2.11.4 Netherlands SiC Power Device Market by End User
12.3.2.12 Switzerland
12.3.2.12.1 Switzerland SiC Power Device Market by Component
12.3.2.12.2 Switzerland SiC Power Device Market by Product Type
12.3.2.12.3 Switzerland SiC Power Device Market by Wafer Size
12.3.2.12.4 Switzerland SiC Power Device Market by End User
12.3.2.13 Austria
12.3.2.13.1 Austria SiC Power Device Market by Component
12.3.2.13.2 Austria SiC Power Device Market by Product Type
12.3.2.13.3 Austria SiC Power Device Market by Wafer Size
12.3.2.13.4 Austria SiC Power Device Market by End User
12.3.2.14 Rest of Western Europe
12.3.2.14.1 Rest of Western Europe SiC Power Device Market by Component
12.3.2.14.2 Rest of Western Europe SiC Power Device Market by Product Type
12.3.2.14.3 Rest of Western Europe SiC Power Device Market by Wafer Size
12.3.2.14.4 Rest of Western Europe SiC Power Device Market by End User
12.4 Asia-Pacific
12.4.1 Asia Pacific SiC Power Device Market by Country
12.4.2 Asia Pacific SiC Power Device Market by Component
12.4.3 Asia Pacific SiC Power Device Market by Product Type
12.4.4 Asia Pacific SiC Power Device Market by Wafer Size
12.4.5 Asia Pacific SiC Power Device Market by End User
12.4.6 China
12.4.6.1 China SiC Power Device Market by Component
12.4.6.2 China SiC Power Device Market by Product Type
12.4.6.3 China SiC Power Device Market by Wafer Size
12.4.6.4 China SiC Power Device Market by End User
12.4.7 India
12.4.7.1 India SiC Power Device Market by Component
12.4.7.2 India SiC Power Device Market by Product Type
12.4.7.3 India SiC Power Device Market by Wafer Size
12.4.7.4 India SiC Power Device Market by End User
12.4.8 Japan
12.4.8.1 Japan SiC Power Device Market by Component
12.4.8.2 Japan SiC Power Device Market by Product Type
12.4.8.3 Japan SiC Power Device Market by Wafer Size
12.4.8.4 Japan SiC Power Device Market by End User
12.4.9 South Korea
12.4.9.1 South Korea SiC Power Device Market by Component
12.4.9.2 South Korea SiC Power Device Market by Product Type
12.4.9.3 South Korea SiC Power Device Market by Wafer Size
12.4.9.4 South Korea SiC Power Device Market by End User
12.4.10 Vietnam
12.4.10.1 Vietnam SiC Power Device Market by Component
12.4.10.2 Vietnam SiC Power Device Market by Product Type
12.4.10.3 Vietnam SiC Power Device Market by Wafer Size
12.4.10.4 Vietnam SiC Power Device Market by End User
12.4.11 Singapore
12.4.11.1 Singapore SiC Power Device Market by Component
12.4.11.2 Singapore SiC Power Device Market by Product Type
12.4.11.3 Singapore SiC Power Device Market by Wafer Size
12.4.11.4 Singapore SiC Power Device Market by End User
12.4.12 Australia
12.4.12.1 Australia SiC Power Device Market by Component
12.4.12.2 Australia SiC Power Device Market by Product Type
12.4.12.3 Australia SiC Power Device Market by Wafer Size
12.4.12.4 Australia SiC Power Device Market by End User
12.4.13 Rest of Asia-Pacific
12.4.13.1 Rest of Asia-Pacific SiC Power Device Market by Component
12.4.13.2 Rest of Asia-Pacific SiC Power Device Market by Product Type
12.4.13.3 Rest of Asia-Pacific SiC Power Device Market by Wafer Size
12.4.13.4 Rest of Asia-Pacific SiC Power Device Market by End User
12.5 Middle East & Africa
12.5.1 Middle East
12.5.1.1 Middle East SiC Power Device Market by country
12.5.1.2 Middle East SiC Power Device Market by Component
12.5.1.3 Middle East SiC Power Device Market by Product Type
12.5.1.4 Middle East SiC Power Device Market by Wafer Size
12.5.1.5 Middle East SiC Power Device Market by End User
12.5.1.6 UAE
12.5.1.6.1 UAE SiC Power Device Market by Component
12.5.1.6.2 UAE SiC Power Device Market by Product Type
12.5.1.6.3 UAE SiC Power Device Market by Wafer Size
12.5.1.6.4 UAE SiC Power Device Market by End User
12.5.1.7 Egypt
12.5.1.7.1 Egypt SiC Power Device Market by Component
12.5.1.7.2 Egypt SiC Power Device Market by Product Type
12.5.1.7.3 Egypt SiC Power Device Market by Wafer Size
12.5.1.7.4 Egypt SiC Power Device Market by End User
12.5.1.8 Saudi Arabia
12.5.1.8.1 Saudi Arabia SiC Power Device Market by Component
12.5.1.8.2 Saudi Arabia SiC Power Device Market by Product Type
12.5.1.8.3 Saudi Arabia SiC Power Device Market by Wafer Size
12.5.1.8.4 Saudi Arabia SiC Power Device Market by End User
12.5.1.9 Qatar
12.5.1.9.1 Qatar SiC Power Device Market by Component
12.5.1.9.2 Qatar SiC Power Device Market by Product Type
12.5.1.9.3 Qatar SiC Power Device Market by Wafer Size
12.5.1.9.4 Qatar SiC Power Device Market by End User
12.5.1.10 Rest of Middle East
12.5.1.10.1 Rest of Middle East SiC Power Device Market by Component
12.5.1.10.2 Rest of Middle East SiC Power Device Market by Product Type
12.5.1.10.3 Rest of Middle East SiC Power Device Market by Wafer Size
12.5.1.10.4 Rest of Middle East SiC Power Device Market by End User
12.5.2. Africa
12.5.2.1 Africa SiC Power Device Market by country
12.5.2.2 Africa SiC Power Device Market by Component
12.5.2.3 Africa SiC Power Device Market by Product Type
12.5.2.4 Africa SiC Power Device Market by Wafer Size
12.5.2.5 Africa SiC Power Device Market by End User
12.5.2.6 Nigeria
12.5.2.6.1 Nigeria SiC Power Device Market by Component
12.5.2.6.2 Nigeria SiC Power Device Market by Product Type
12.5.2.6.3 Nigeria SiC Power Device Market by Wafer Size
12.5.2.6.4 Nigeria SiC Power Device Market by End User
12.5.2.7 South Africa
12.5.2.7.1 South Africa SiC Power Device Market by Component
12.5.2.7.2 South Africa SiC Power Device Market by Product Type
12.5.2.7.3 South Africa SiC Power Device Market by Wafer Size
12.5.2.7.4 South Africa SiC Power Device Market by End User
12.5.2.8 Rest of Africa
12.5.2.8.1 Rest of Africa SiC Power Device Market by Component
12.5.2.8.2 Rest of Africa SiC Power Device Market by Product Type
12.5.2.8.3 Rest of Africa SiC Power Device Market by Wafer Size
12.5.2.8.4 Rest of Africa SiC Power Device Market by End User
12.6. Latin America
12.6.1 Latin America SiC Power Device Market by country
12.6.2 Latin America SiC Power Device Market by Component
12.6.3 Latin America SiC Power Device Market by Product Type
12.6.4 Latin America SiC Power Device Market by Wafer Size
12.6.5 Latin America SiC Power Device Market by End User
12.6.6 Brazil
12.6.6.1 Brazil SiC Power Device Market by Component
12.6.6.2 Brazil SiC Power Device Market by Product Type
12.6.6.3 Brazil SiC Power Device Market by Wafer Size
12.6.6.4 Brazil SiC Power Device Market by End User
12.6.7 Argentina
12.6.7.1 Argentina SiC Power Device Market by Component
12.6.7.2 Argentina SiC Power Device Market by Product Type
12.6.7.3 Argentina SiC Power Device Market by Wafer Size
12.6.7.4 Argentina SiC Power Device Market by End User
12.6.8 Colombia
12.6.8.1 Colombia SiC Power Device Market by Component
12.6.8.2 Colombia SiC Power Device Market by Product Type
12.6.8.3 Colombia SiC Power Device Market by Wafer Size
12.6.8.4 Colombia SiC Power Device Market by End User
12.6.9 Rest of Latin America
12.6.9.1 Rest of Latin America SiC Power Device Market by Component
12.6.9.2 Rest of Latin America SiC Power Device Market by Product Type
12.6.9.3 Rest of Latin America SiC Power Device Market by Wafer Size
12.6.9.4 Rest of Latin America SiC Power Device Market by End User
13 Company Profile
13.1 ALLEGRO MICROSYSTEMS, INC.
13.1.1 Company Overview
13.1.2 Financials
13.1.3 Products/ Services Offered
13.1.4 SWOT Analysis
13.1.5 The SNS View
13.2 Infineon Technologies AG
13.2.1 Company Overview
13.2.2 Financials
13.2.3 Products/ Services Offered
13.2.4 SWOT Analysis
13.2.5 The SNS View
13.3 ROHM Co., Ltd.
13.3.1 Company Overview
13.3.2 Financials
13.3.3 Products/ Services Offered
13.3.4 SWOT Analysis
13.3.5 The SNS View
13.4 STMicroelectronics N.V.
13.4 Company Overview
13.4.2 Financials
13.4.3 Products/ Services Offered
13.4.4 SWOT Analysis
13.4.5 The SNS View
13.5 ON SEMICONDUCTOR CORPORATION (on semi)
13.5.1 Company Overview
13.5.2 Financials
13.5.3 Products/ Services Offered
13.5.4 SWOT Analysis
13.5.5 The SNS View
13.6 WOLFSPEED, INC.
13.6.1 Company Overview
13.6.2 Financials
13.6.3 Products/ Services Offered
13.6.4 SWOT Analysis
13.6.5 The SNS View
13.7 Gene Sic Semiconductor
13.7.1 Company Overview
13.7.2 Financials
13.7.3 Products/ Services Offered
13.7.4 SWOT Analysis
13.7.5 The SNS View
13.8 TT Electronics plc.
13.8.1 Company Overview
13.8.2 Financials
13.8.3 Products/ Services Offered
13.8.4 SWOT Analysis
13.8.5 The SNS View
13.9 Mitsubishi Electric Corporation
13.9.1 Company Overview
13.9.2 Financials
13.9.3 Products/ Services Offered
13.9.4 SWOT Analysis
13.9.5 The SNS View
13.10 Powerex Inc.
13.10.1 Company Overview
13.10.2 Financials
13.10.3 Products/ Services Offered
13.10.4 SWOT Analysis
13.10.5 The SNS View
13.11 Toshiba Corporation
13.11.1 Company Overview
13.11.2 Financials
13.11.3 Products/ Services Offered
13.11.4 SWOT Analysis
13.11.5 The SNS View
13.12 FUJI ELECTRIC CO., LTD.
13.12.1 Company Overview
13.12.2 Financials
13.12.3 Products/ Services Offered
13.12.4 SWOT Analysis
13.12.5 The SNS View
14. Competitive Landscape
14.1 Competitive Bench marking
14.2 Market Share Analysis
14.3 Recent Developments
14.3.1 Industry News
14.3.2 Company News
14.3.3 Mergers & Acquisitions
15. USE Cases and Best Practices
16. Conclusion
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Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.
Step 2: Primary Research
When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data. This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.
We at SNS Insider have divided Primary Research into 2 parts.
Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.
This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.
Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.
Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.
Step 3: Data Bank Validation
Once all the information is collected via primary and secondary sources, we run that information for data validation. At our intelligence centre our research heads track a lot of information related to the market which includes the quarterly reports, the daily stock prices, and other relevant information. Our data bank server gets updated every fortnight and that is how the information which we collected using our primary and secondary information is revalidated in real time.
Step 4: QA/QC Process
After all the data collection and validation our team does a final level of quality check and quality assurance to get rid of any unwanted or undesired mistakes. This might include but not limited to getting rid of the any typos, duplication of numbers or missing of any important information. The people involved in this process include technical content writers, research heads and graphics people. Once this process is completed the title gets uploader on our platform for our clients to read it.
Step 5: Final QC/QA Process:
This is the last process and comes when the client has ordered the study. In this process a final QA/QC is done before the study is emailed to the client. Since we believe in giving our clients a good experience of our research studies, therefore, to make sure that we do not lack at our end in any way humanly possible we do a final round of quality check and then dispatch the study to the client.
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