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The Semiconductor Bonding Market Size was valued at USD 950.17 Million in 2023 and is expected to reach USD 1251.20 Million by 2031 and grow at a CAGR of 3.5% over the forecast period 2024-2031.
The Semiconductor Bonding Market is a vital sector within the semiconductor industry, crucial for fabricating integrated circuits (ICs) and electronic devices. It encompasses techniques such as die bonding and wafer bonding, driven by technological advancements, the need for miniaturization, and increasing device complexity across various industries. Die bonding, a fundamental packaging technique, dominates the market alongside wafer bonding, which offers benefits like surface bubble prevention and enhanced material combination flexibility. Atoms are connected in a regular, periodic manner to form semiconductors, such as Silicon (Si), where each atom is surrounded by eight electrons. The electrons that encircle each atom in a semiconductor are connected covalently. Two atoms sharing a pair of electrons make a covalent connection. Each atom forms four covalent bonds with the four other atoms in its immediate vicinity. As a result, each atom and its four surrounding atoms share eight electrons. To create composite 3D structures, cavities, and closed fluid channels that are mechanically strong and able to provide strong electrical contact, semiconductor bonding is employed. It is essential to tightly connect two or more micro-components. The market is expected to experience significant growth due to the growing demand for small electronic devices, the increasing adoption of over-the-counter diets for IoT devices, and the growing demand for electric and hybrid vehicles. The high cost of ownership has hampered market growth. However, the increasing demand for 3D semiconductor integration and packaging and the increasing adoption of IoT and AI in the automotive sector creates an opportunity for semiconductor bonding markets.
The growing prevalence of stacked die technology in IoT devices
The semiconductor bonding market is experiencing growth propelled by the widespread adoption of stacked die technology in IoT devices. A stacked die involves the attachment of one bare die atop another within a single semiconductor package, optimizing the use of placement areas on a substrate for multiple functionalities. This approach enhances the electrical performance of devices by reducing the length of interconnections between circuits, resulting in faster signal generation. Original equipment manufacturers (OEMs) in the semiconductor industry are actively seeking to capitalize on the advantages of IoT beyond connectivity. Applications such as building and home automation, smart manufacturing, connected logistics, smart retail, smart mobility, and transportation increasingly deploy IoT devices and technologies like sensors, RFID tags, smart meters, smart beacons, and distribution control systems. In this context, semiconductor bonding techniques play a crucial role in attaching multi-stacked dies on substrates, utilizing minimal space.
RESTRAINTS:
Elevated ownership expenses
Semiconductor bonding equipment constitutes sophisticated machinery demanding substantial input power for executing die-attach operations. The power consumption of these devices ranges from hundreds to thousands of watts. The manufacturing expenses associated with semiconductor bonding equipment are notably elevated due to the incorporation of intricate and costly components. The assembly of various sizable and small parts, including screens, bonding hands, vacuum systems, sensors, and heat sources, adds to the overall cost. Consequently, the production and ownership costs of semiconductor bonding equipment, particularly for die bonder equipment, are relatively high. Moreover, the exorbitant expense of semiconductor wafers contributes to an increased operating cost for semiconductor bonding, acting as a deterrent to the market's growth.
OPPORTUNITIES:
The growing integrated (IC) sector in China.
The increasing desire for thin wafers within the semiconductor sector is a significant driver for the expansion of the wafer bonding market. Progress in thin wafer technology has successfully addressed numerous conventional fabrication challenges. The thin wafer industry, offering advantages like ultra-low power consumption and ultra-high electrical performance, is drawing the interest of Chinese IC manufacturers aiming to harness this technology. Currently, the primary objective of many IC suppliers in China is the pursuit of thin chips that deliver high performance at a low operating voltage and cost.
CHALLENGES:
The imbalance in the mechanical movement of parts and the fragility of thin wafers, make them prone to damage under pressure or stress.
Die bonder equipment utilizes mechanical movements for the precise picking and placing of the die during the bonding process. These machines feature numerous moving parts that demand accurate movement to effectively attach the die to the substrate. However, issues such as instability and abnormal movement of mechanical joints can lead to vibrations in the moving parts. These vibrations in die bonders may result in the misplacement or cracking of the die, posing a significant challenge for manufacturers of semiconductor bonding equipment.
Thin wafers, being delicate and prone to damage from pressure or stress, present a unique set of challenges. Their high flexibility makes them susceptible to breakage even under minimal pressure or stress. Thin wafer-based dies are particularly vulnerable to breakage during the internal process of wafer thinning. Market players are actively addressing this challenge by developing support systems capable of handling thin wafers throughout various processes, including wafer bonding and debonding.
With the increasing spread of COVID-19, there is an increase in the number of health facilities to accommodate the growing number of patients worldwide. This has increased the need for efficient LED lighting technology in health facilities, which is expected to further the need for semiconductor bonding equipment. LED is expected to be part of the fastest-growing segment of the semiconductor bond market with a CAGR of 5.7% between 2024 and 2031. This segment has seen a low impact compared to other components, due to the growth of LED penetration in several sectors, such as consumer electronics, automotive, commercial, residential, and construction. LEDs are widely used in commercial and industrial environments, as LED lighting offers a variety of benefits, including energy efficiency, low heat dissipation, cost efficiency, and nanosecond conversion power. The use of low voltage in LED devices offers a variety of benefits, such as high efficiency and low power consumption. The growing demand for LED components in the healthcare sector has stimulated market growth following the COVID-19 epidemic.
The ongoing Russia-Ukraine crisis has deeply impacted the semiconductor industry, specifically affecting the supply chain of critical raw materials crucial for semiconductor manufacturing, such as neon, palladium, and various gases and metals. Given the significant roles played by both Ukraine and Russia as major producers of these materials, the conflict has introduced uncertainties into the supply chain, leading to short-term management strategies but unclear long-term effects. Companies are currently grappling with disruptions through existing inventories and alternative suppliers, anticipating potential price increases for raw materials. Contingency plans are being advised for the semiconductor industry, urging exploration of alternative material sources and investments in technologies like neon recycling to mitigate risks associated with supply chain disruptions caused by the conflict. Additionally, the crisis has triggered a reassessment of decisions regarding capacity expansion and local manufacturing, with a growing trend towards localizing the semiconductor supply chain to reduce dependence on geopolitically sensitive regions, albeit potentially incurring higher costs. The industry is navigating these challenges by diversifying supply sources and contemplating longer-term structural changes to enhance resilience against geopolitical disruptions.
Despite the prevailing economic slowdown, the semiconductor bonding market has displayed resilience and is anticipated to maintain its growth trajectory. This positive outlook can be attributed to various factors, including the escalating adoption of stacked die technology in Internet of Things (IoT) devices and a continuous stream of product launches, partnerships, and collaborations associated with semiconductor bonding solutions. Wafer bonding technology, particularly the die-to-die bonding segment, has been at the forefront of market leadership and is expected to persist in its dominance, owing to its widespread applications in sectors such as RF devices, MEMS and sensors, CMOS image sensors, LED, and 3D NAND. The Asia-Pacific region, led by China, plays a pivotal role in the market, contributing significantly to the global semiconductor bonding industry.
Despite economic challenges, the semiconductor bonding market is positioned for growth, fueled by technological advancements and a growing demand for sophisticated semiconductor applications. Substantial investments and a dedicated focus on Research and Development (R&D) by major companies and governments are anticipated to further boost the market's resilience, ensuring its sustained growth amidst economic fluctuations.
By Type
In 2023, the market was led by the wafer bonder segment. Wafer bonding is gaining prominence in applications such as silicon-on-insulator (SOI) devices, silicon-based sensors and actuators, and optical devices. This technology offers various advantages, including surface bubble prevention, bonding of diverse compounds, low-temperature bonding, high vacuum bonding, and a thinning method for the smart cut procedure. The use of wafer bonding provides increased flexibility in material combinations during design and fabrication, contributing significantly to the global growth of the semiconductor bonding market.
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By Bonding Technology
In 2023, the market was predominantly led by the Die Bonding segment, more than 64% of the market share. Die bonding, a semiconductor packaging technique, involves affixing a die (or chip) to a material or package using adhesive or sinter, commonly known as die attach or die placement. The procedure begins by selecting a die from a waffle pack and positioning it onto the material.
By Application
The LED application segment is projected to capture the largest market share in the semiconductor bonding market. This dominance is attributed to the increasing integration of LEDs across various sectors, including consumer electronics, automotive, commercial, residential, and architectural, albeit with a lesser impact than other segments. LED lighting finds extensive use in commercial and industrial environments, leveraging its advantages such as energy efficiency, minimal heat emissions, cost-effectiveness, and rapid nanosecond switching capability. Additionally, the 3D NAND segment is anticipated to exhibit a high Compound Annual Growth Rate (CAGR) from 2024 to 2031.
APAC is expected to register the highest CAGR in the semiconductor bonding market as a whole at the time of forecasting. More than 70% of OSAT players worldwide have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor manufacturing process. The growing number of IDM in the region is expected to boost the growth of the semiconductor bond market in the near future. Similarly, mass production of electronic products such as smartphones, apparel, and white goods in China and Taiwan may also accelerate APAC market growth.
The key players in the semiconductor bonding market are BE Semiconductor Industries, Google. Inc (US), Intel Corporation (US), SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Robotics Corporation, Shiaura Mechatronics, Shiaura Mechatronics, NVIDIA Corporation (US), Qualcomm Technology (US) & Other Players.
RECENT DEVELOPMENT
In November 2022: SÜSS MicroTec SE introduced a groundbreaking low-temperature field-assisted bonding technology named Impulse Current Bonding. This innovative Sy&Se technology, stemming from a noteworthy scientific breakthrough, is compatible with both manual and automatic wafer bonder systems. The current impulse bonding method combines the resilience of anodic bonding with the material adaptability found in more intricate bonding approaches.
In August 2022: EV Group extended its collaboration with the Industrial Technology Research Institute, a prominent applied technology research institute situated in Hsinchu, Taiwan. The joint effort aimed at advancing heterogeneous integration processes. As a member of the Hi-CHIP Alliance, EVG Group supplied various wafer bonding and lithography systems, including the GEMINI FB hybrid bonding system and the EVG 850 DB automated debonding system.
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | US$ 950.17 Million |
| Market Size by 2031 | US$ 1251.20 Million |
| CAGR | CAGR of 3.5% From 2024 to 2031 |
| Base Year | 2023 |
| Forecast Period | 2024-2031 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Type (Wafer Bonder, Die Bonder, Flip Chip Bonder) • By Process Type (Die-To Wafer Bonding, Die-To Die Bonding, Wafer-To-Wafer Bonding) • By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology) • By Application (Mems And Sensors, LED, RF Devices, Cmos Image Sensors, 3D NAND) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia, Rest of Latin America) |
| Company Profiles | BE Semiconductor Industries, Google. Inc (US), Intel Corporation (US), SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Robotics Corporation, Shiaura Mechatronics, Shiaura Mechatronics, NVIDIA Corporation (US), and Qualcomm Technology (US). |
| Key Drivers | • The growing prevalence of stacked die technology in IoT devices |
| Restraints | • Elevated ownership expenses |
The Industrial Refrigeration Market size was valued at USD 0.91 billion in 2022 at a CAGR of 3.7%.
The market value is expected to reach USD 1.22 billion by 2030.
The market has been segmented with respect to type, process type, bonding technology and application.
Top-down research, bottom-up research, qualitative research, quantitative research, and Fundamental research.
Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.
TABLE OF CONTENTS
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Industry Flowchart
3. Research Methodology
4. Market Dynamics
4.1 Drivers
4.2 Restraints
4.3 Opportunities
4.4 Challenges
5. Impact Analysis
5.1 Impact of Russia-Ukraine Crisis
5.2 Impact of Economic Slowdown on Major Countries
5.2.1 Introduction
5.2.2 United States
5.2.3 Canada
5.2.4 Germany
5.2.5 France
5.2.6 UK
5.2.7 China
5.2.8 Japan
5.2.9 South Korea
5.2.9 India
6. Value Chain Analysis
7. Porter’s 5 Forces Model
8. Pest Analysis
9. Semiconductor Bonding Market, By Type
9.1 Introduction
9.2 Trend Analysis
9.3 Wafer Bonder
9.4 Die Bonder
9.5 Flip Chip Bonder
10. Semiconductor Bonding Market, By Process Type
10.1 Introduction
10.2 Trend Analysis
10.3 Die-To Wafer Bonding
10.4 Die-To Die Bonding
10.5 Wafer-To-Wafer Bonding
11. Semiconductor Bonding Market, By Bonding Technology
11.1 Introduction
11.2 Trend Analysis
11.3 Die Bonding Technology
11.4 Wafer Bonding Technology
12. Semiconductor Bonding Market, By Application
12.1 Introduction
12.2 Trend Analysis
12.3 Mems and Sensors
12.4 LED
12.5 RF Devices
12.6 Cmos Image Sensors
12.7 3D NAND
13. Regional Analysis
13.1 Introduction
14.2 North America
14.2.1 USA
14.2.2 Canada
14.2.3 Mexico
14.3 Europe
14.3.1 Eastern Europe
14.3.1.1 Poland
14.3.1.2 Romania
14.3.1.3 Hungary
14.3.1.4 Turkey
14.3.1.5 Rest of Eastern Europe
14.3.2 Western Europe
14.3.2.1 Germany
14.3.2.2 France
14.3.2.3 UK
14.3.2.4 Italy
14.3.2.5 Spain
14.3.2.6 Netherlands
14.3.2.7 Switzerland
14.3.2.8 Austria
14.3.2.9 Rest of Western Europe
14.4 Asia-Pacific
14.4.1 China
14.4.2 India
14.4.3 Japan
14.4.4 South Korea
14.4.5 Vietnam
14.4.6 Singapore
14.4.7 Australia
14.4.8 Rest of Asia Pacific
14.5 The Middle East & Africa
14.5.1 Middle East
14.5.1.1 UAE
14.5.1.2 Egypt
14.5.1.3 Saudi Arabia
14.5.1.4 Qatar
14.5.1.5 Rest of the Middle East
14.5.2 Africa
14.5.2.1 Nigeria
14.5.2.2 South Africa
14.5.2.3 Rest of Africa
14.6 Latin America
14.6.1 Brazil
14.6.2 Argentina
14.6.3 Colombia
14.6.4 Rest of Latin America
15. Company Profiles
15.1 BE Semiconductor Industries
15.1.1 Company Overview
15.1.2 Financials
15.1.3 Products/ Services Offered
15.1.4 SWOT Analysis
15.1.5 The SNS View
15.2 Google. Inc (US)
15.2.1 Company Overview
15.2.2 Financials
15.2.3 Products/ Services Offered
15.2.4 SWOT Analysis
15.2.5 The SNS View
15.3 Intel Corporation (US)
15.3.1 Company Overview
15.3.2 Financials
15.3.3 Products/ Services Offered
15.3.4 SWOT Analysis
15.3.5 The SNS View
15.4 SUSS MicroTech
15.4 Company Overview
15.4.2 Financials
15.4.3 Products/ Services Offered
15.4.4 SWOT Analysis
15.4.5 The SNS View
15.5 ASM Pacific Technology
15.5.1 Company Overview
15.5.2 Financials
15.5.3 Products/ Services Offered
15.5.4 SWOT Analysis
15.5.5 The SNS View
15.6 Panasonic
15.6.1 Company Overview
15.6.2 Financials
15.6.3 Products/ Services Offered
15.6.4 SWOT Analysis
15.6.5 The SNS View
15.7 Yamaha Robotics Corporation
15.7.1 Company Overview
15.7.2 Financials
15.7.3 Products/ Services Offered
15.7.4 SWOT Analysis
15.7.5 The SNS View
15.8 Shiaura Mechatronics
15.8.1 Company Overview
15.8.2 Financials
15.8.3 Products/ Services Offered
15.8.4 SWOT Analysis
15.8.5 The SNS View
15.9 NVIDIA Corporation (US)
15.9.1 Company Overview
15.9.2 Financials
15.9.3 Products/ Services Offered
15.9.4 SWOT Analysis
15.9.5 The SNS View
15.10 Qualcomm Technology (US)
15.10.1 Company Overview
15.10.2 Financials
15.10.3 Products/ Services Offered
15.10.4 SWOT Analysis
15.10.5 The SNS View
16. Competitive Landscape
16.1 Competitive Benchmarking
16.2 Market Share Analysis
16.3 Recent Developments
16.3.1 Industry News
16.3.2 Company News
16.3.3 Mergers & Acquisitions
17. USE Cases and Best Practices
18. Conclusion
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By Type
Wafer Bonder
Die Bonder
Flip Chip Bonder
By Process Type
Die-To Wafer Bonding
Die-To Die Bonding
Wafer-To-Wafer Bonding
By Bonding Technology
Die Bonding Technology
Wafer Bonding Technology
By Application
Mems And Sensors
LED
RF Devices
Cmos Image Sensors
3D NAND
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REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of the Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Rest of Latin America
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Product Analysis
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Geographic Analysis
Additional countries in any of the regions
Company Information
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