Get more information on Electronic Packaging Market - Request Sample Report
The Electronic Packaging Market size was valued at USD 1.01 billion in 2023 and is expected to reach USD 4.48 billion by 2032 and grow at a CAGR of 18.02% over the forecast period 2024-2032.
The electronic packaging market is a key sector within the electronics industry as it is a huge market with a variety of products and technologies used to protect electronic components and interconnect them. Effective and high-quality electronic and semiconductor packaging is designed to protect components from a variety of harmful impacts and prevent water, electrostatic discharge, harsh weather conditions, dust, corrosion, and other impacts from damaging electronic products like smartphones, TVs, tablets, set-top boxes, and digital media adapters, etc. In the U.S., the Department of Commerce announced that it is launching a competition in 2023 with up to USD 1.6 billion in funding, which was authorized by the Clearing House Interbank Payments System (CHIPS) and Science Act. This funding is intended to sponsor semiconductor advanced packaging research and development activities. CHIPS for America group of agencies plans to give four or five awards of about USD 150 million for each of its five R&D focus areas.
It is used in a variety of army and aerospace facilities packed with semiconductor devices such as information handling units, information screen systems, and aircraft control units because it allows for reduced board area, weight, and routing complexity at the PCB level. Electronic packaging includes communication ICs, memory power management devices, analog, digital, and mixed-signal ICs to drive applications in clinical diagnostics, therapy, and medical imaging, as well as die shrinks in the same package to improve product upgradeability. Integrating electronics expands human interface possibilities, and higher density efficient battery technologies imply that the electronic packaging market share will grow significantly in the forecast years.
Drivers
Growth in consumer electronics manufacturing increases the demand for good packaging.
The development of consumer electronics, such as smartphones, tablets, laptops, smartwatches, and home entertainment systems, has increased technological advancement and end-users desire for product performance, aesthetics, and low-weight packaging solutions. As a result, developmental trends of electronics involve increasing miniaturization and performance of devices, requiring highly advanced and intricate packaging solutions that would ensure high-density integration of several functionalities and feasible operation in various environments reflected in thermal management and reaction to electromagnetic and radiofrequency fields.
For example, smartphone packaging is highly developing with each new model. Each new generation of smartphones is expected to perform at higher levels, with longer battery life, advanced camera functions, 5G capabilities, and support for biometric authentication solutions. All these developments should be packed in a limited space of height of the size of the average smartphone size that would permit their operation together with minimum expected overheating by users and interference with proper functioning of other devices due to electromagnetic and radiofrequency fields.
The rising popularity of IoT and wireless devices.
IoT refers to the concept of connecting different industrial devices and systems to the Internet for data collection, processing, and communication among various devices. The range of such applications includes different devices and systems for smart homes, industrial automation, healthcare, agriculture, etc., which requires advanced packaging to make these devices more reliable, efficient, and operatively connectable. Smart homes comprise IoT technologies for producing smart thermostats, security cameras, smart lighting, refrigerators, and virtually any other household item. These devices are supposed to operate in different climate zones, therefore, the packaging solution in such cases should be able to endure significant changes in temperature, humidity electromagnetic emission, and other impacts.
Industrial automation IoT includes various sensors, actuators, machines, and control systems connected for monitoring and improving manufacturing processes 24/7. Such devices are used in harsh environmental conditions, including high temperatures, fluctuations, and vibrations, exposure to different chemical components, which implies much more reliable and resistant packaging. In such applications, molded interconnect devices and chip-on-board technology can be very useful for IoT industrial packaging, allowing for reliable contact and continuous operative data exchanges.
Restraints
High initial costs of advanced packaging technologies.
Advanced packaging solutions, such as wafer-level packaging, SiP, 3D packaging, and FOWLP, are complicated in terms of implementation, requiring more effort and using more sophisticated devices and materials. Existing manufacturing costs already affect the price of production. Furthermore, the cost of individual solutions may fluctuate depending on the context of their implementation. The high cost of advanced packaging technologies may become prohibitive for markets such as consumer electronics and the automotive market, where consumers look for material designs with an optimal price-to-quality relationship. The initial setup for the advanced packaging system may be high. For instance, for the 3D packaging and TSV technology to work, certain expensive tools are needed, such as lithography with light sources, wire bonding, flip-chip bonding tools, and alignment assembly equipment. The potential costs of bonding tools and lithography equipment can reach as high as USD 10.82 million, while accuracy tools may cost around USD 1.82 million. Setting up the materials and implementing the manufacturing techniques of advanced packaging technologies are also very expensive.
By Type
The corrugated boxes segment market share was over 38% in 2023. Their dominance persists as they have become the backbone for electronic product packaging because they are strong, versatile, and cost-effective. More importantly, the structure of corrugated cardboard, a fluted medium joined to two outer liners, creates an excellent cushioning and shock-absorbing effect, required to protect the delicate electronic devices during transit and handling. It is also worth mentioning that the feature of being convertible into any shape, style, and size allows for accurate fitment of the particular device to minimize the damage risk.
The bags and pouches segment has a faster CAGR during the forecast period 2024-3032. Bags and pouches have gradually become an essential part of electronic packaging. They not only serve as a cover but also act as protection from surrounding influences, presentation of the product, symbol of the product, and material for preserving and shipping logistics. Altogether, it should be resistant to different physical and chemical influences. For small electronic components, it may be an antistatic bag saving the product from static energy.
By Material
The plastic segment dominated with a market share of over 35% in 2023 and it is also the fastest-growing segment during the forecast period 2024-2032. Plastics have long since been an important material in electronic packaging. Exposure to sensitive electronic hardware and the benefits plastics provide in spill and shock resistance make them ideal in specialized cases. These materials are often polyethylene, polypropylene, and PVC as they insulate and defend against moisture and dust, both of which can cause electrical shorting. Polycarbonate’s transparency and remarkable resistance to impact make it excellent for sequestering the displays in any electronics.
Get Customized Report as per your Business Requirement - Request For Customized Report
Asia-Pacific led the market in 2023 with more than 40% market share. The presence of numerous electronic packaging firms providing electronic packaging material and technology, such as Samsung, LG, and Taiwan, further drives the market in the region even more. Additionally, the escalating population and soaring disposable income in the region are two primary reasons for the advancing demand for consumer electronics, which propels the electronic packaging market in the region even further. China led the market in 2023, followed by India. Furthermore, government-supported programs and investments to boost cutting-edge technology and the establishment of solutions for semiconductor packaging drive the market. North America is growing s during the forecast period 2024-2032.
The key players in the electronic packaging market are STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, Sealed Air Corporation & Other Players.
January 2024: INEOS Styrolution launched Zylar EX350, a new grade of methyl methacrylate butadiene styrene materials. Zylar EX350 provides a balance of stiffness and toughness and is suitable for carrier tapes used in the packaging of electronic components.
September 2023: SCHOTT announced the microelectronic packages designed for the aerospace market. These packages are lightweight and offer reliable protection for electronic components. The weight of the Schott Hermes packages is reduced by up to two-thirds compared to traditional Kovar-based packaging.
May 2024: American Packaging Corporation announced the opening of a second production unit for digitally printed flexible packaging in Wisconsin. The equipment of the second unit incorporates digital printing, laminating, and pouch-making technology and specializes in rapid order fulfillment.
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | USD 1.01 billion |
| Market Size by 2032 | USD 4.48 billion |
| CAGR | CAGR of 18.02% From 2024 to 2032 |
| Base Year | 2023 |
| Forecast Period | 2024-2032 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Type (Corrugated Boxes, Thermoformed Trays, Blister Packs And Clamshells, Paperboard Boxes, Bags And Pouches, Protective Packaging) • By Material (Plastic, Glass, Metal, Others) • By Packaging Technology (Through Hole Mounting, Chip Scale Packages, Surface Mount Technology) • By End-User (Consumer Electronics, Automotive, Aerospace & Defense, Telecommunication) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia, Rest of Latin America) |
| Company Profiles | STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, Sealed Air Corporation |
| Key Drivers | • Growth in consumer electronics manufacturing increases the demand for good packaging. • The rising popularity of IoT and wireless devices. |
| RESTRAINTS | • High initial costs of advanced packaging technologies. |
Ans: The Electronic Packaging Market is expected to grow at a CAGR of 18.02% during 2024-2032.
Ans: Electronic Packaging Market size was USD 1.01 billion in 2023 and is expected to Reach USD 4.48 billion by 2032.
Ans: Growth in consumer electronics manufacturing increases the demand for the Electronic Packaging Market.
Ans: The corrugated boxes segment dominated the Electronic Packaging Market.
Ans: Asia Pacific dominates the Electronic Packaging Market in 2023.
TABLE OF CONTENTS
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Industry Flowchart
3. Research Methodology
4. Market Dynamics
4.1 Drivers
4.2 Restraints
4.3 Opportunities
4.4 Challenges
5. Porter’s 5 Forces Model
6. PEST Analysis
7. Electronic Packaging Market Segmentation, By Type
7.1 Introduction
7.2 Corrugated Boxes
7.3 Thermoformed Trays
7.4 Blister packs and Clamshell
7.5 Paperboard Boxes
7.6 Bags and Pouches
7.7 Protective Packaging
8. Electronic Packaging Market Segmentation, By Material
8.1 Introduction
8.2 Plastic
8.3 Glass
8.4 Metal
8.5 Others
9. Electronic Packaging Market Segmentation, By Packaging Technology
9.1 Introduction
9.2 Through Hole Mounting
9.3 Chip Scale Packages
9.4 Surface Mount Technology
10. Electronic Packaging Market Segmentation, By End User
10.1 Introduction
10.2 Consumer Electronics
10.3 Automotive
10.4 Aerospace & Defense
10.5 Telecommunication
11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1 Trend Analysis
11.2.2 North America Electronic Packaging Market by Country
11.2.3 North America Electronic Packaging Market By Type
11.2.4 North America Electronic Packaging Market By Material
11.2.5 North America Electronic Packaging Market By Packaging Technology
11.2.6 North America Electronic Packaging Market By End User
11.2.7 USA
11.2.7.1 USA Electronic Packaging Market By Type
11.2.7.2 USA Electronic Packaging Market By Material
11.2.7.3 USA Electronic Packaging Market By Packaging Technology
11.2.7.4 USA Electronic Packaging Market By End User
11.2.8 Canada
11.2.8.1 Canada Electronic Packaging Market By Type
11.2.8.2 Canada Electronic Packaging Market By Material
11.2.8.3 Canada Electronic Packaging Market By Packaging Technology
11.2.8.4 Canada Electronic Packaging Market By End User
11.2.9 Mexico
11.2.9.1 Mexico Electronic Packaging Market By Type
11.2.9.2 Mexico Electronic Packaging Market By Material
11.2.9.3 Mexico Electronic Packaging Market By Packaging Technology
11.2.9.4 Mexico Electronic Packaging Market By End User
11.3 Europe
11.3.1 Trend Analysis
11.3.2 Eastern Europe
11.3.2.1 Eastern Europe Electronic Packaging Market by Country
11.3.2.2 Eastern Europe Electronic Packaging Market By Type
11.3.2.3 Eastern Europe Electronic Packaging Market By Material
11.3.2.4 Eastern Europe Electronic Packaging Market By Packaging Technology
11.3.2.5 Eastern Europe Electronic Packaging Market By End User
11.3.2.6 Poland
11.3.2.6.1 Poland Electronic Packaging Market By Type
11.3.2.6.2 Poland Electronic Packaging Market By Material
11.3.2.6.3 Poland Electronic Packaging Market By Packaging Technology
11.3.2.6.4 Poland Electronic Packaging Market By End User
11.3.2.7 Romania
11.3.2.7.1 Romania Electronic Packaging Market By Type
11.3.2.7.2 Romania Electronic Packaging Market By Material
11.3.2.7.3 Romania Electronic Packaging Market By Packaging Technology
11.3.2.7.4 Romania Electronic Packaging Market By End User
11.3.2.8 Hungary
11.3.2.8.1 Hungary Electronic Packaging Market By Type
11.3.2.8.2 Hungary Electronic Packaging Market By Material
11.3.2.8.3 Hungary Electronic Packaging Market By Packaging Technology
11.3.2.8.4 Hungary Electronic Packaging Market By End User
11.3.2.9 Turkey
11.3.2.9.1 Turkey Electronic Packaging Market By Type
11.3.2.9.2 Turkey Electronic Packaging Market By Material
11.3.2.9.3 Turkey Electronic Packaging Market By Packaging Technology
11.3.2.9.4 Turkey Electronic Packaging Market By End User
11.3.2.10 Rest of Eastern Europe
11.3.2.10.1 Rest of Eastern Europe Electronic Packaging Market By Type
11.3.2.10.2 Rest of Eastern Europe Electronic Packaging Market By Material
11.3.2.10.3 Rest of Eastern Europe Electronic Packaging Market By Packaging Technology
11.3.2.10.4 Rest of Eastern Europe Electronic Packaging Market By End User
11.3.3 Western Europe
11.3.3.1 Western Europe Electronic Packaging Market by Country
11.3.3.2 Western Europe Electronic Packaging Market By Type
11.3.3.3 Western Europe Electronic Packaging Market By Material
11.3.3.4 Western Europe Electronic Packaging Market By Packaging Technology
11.3.3.5 Western Europe Electronic Packaging Market By End User
11.3.3.6 Germany
11.3.3.6.1 Germany Electronic Packaging Market By Type
11.3.3.6.2 Germany Electronic Packaging Market By Material
11.3.3.6.3 Germany Electronic Packaging Market By Packaging Technology
11.3.3.6.4 Germany Electronic Packaging Market By End User
11.3.3.7 France
11.3.3.7.1 France Electronic Packaging Market By Type
11.3.3.7.2 France Electronic Packaging Market By Material
11.3.3.7.3 France Electronic Packaging Market By Packaging Technology
11.3.3.7.4 France Electronic Packaging Market By End User
11.3.3.8 UK
11.3.3.8.1 UK Electronic Packaging Market By Type
11.3.3.8.2 UK Electronic Packaging Market By Material
11.3.3.8.3 UK Electronic Packaging Market By Packaging Technology
11.3.3.8.4 UK Electronic Packaging Market By End User
11.3.3.9 Italy
11.3.3.9.1 Italy Electronic Packaging Market By Type
11.3.3.9.2 Italy Electronic Packaging Market By Material
11.3.3.9.3 Italy Electronic Packaging Market By Packaging Technology
11.3.3.9.4 Italy Electronic Packaging Market By End User
11.3.3.10 Spain
11.3.3.10.1 Spain Electronic Packaging Market By Type
11.3.3.10.2 Spain Electronic Packaging Market By Material
11.3.3.10.3 Spain Electronic Packaging Market By Packaging Technology
11.3.3.10.4 Spain Electronic Packaging Market By End User
11.3.3.11 Netherlands
11.3.3.11.1 Netherlands Electronic Packaging Market By Type
11.3.3.11.2 Netherlands Electronic Packaging Market By Material
11.3.3.11.3 Netherlands Electronic Packaging Market By Packaging Technology
11.3.3.11.4 Netherlands Electronic Packaging Market By End User
11.3.3.12 Switzerland
11.3.3.12.1 Switzerland Electronic Packaging Market By Type
11.3.3.12.2 Switzerland Electronic Packaging Market By Material
11.3.3.12.3 Switzerland Electronic Packaging Market By Packaging Technology
11.3.3.12.4 Switzerland Electronic Packaging Market By End User
11.3.3.13 Austria
11.3.3.13.1 Austria Electronic Packaging Market By Type
11.3.3.13.2 Austria Electronic Packaging Market By Material
11.3.3.13.3 Austria Electronic Packaging Market By Packaging Technology
11.3.3.13.4 Austria Electronic Packaging Market By End User
11.3.3.14 Rest of Western Europe
11.3.3.14.1 Rest of Western Europe Electronic Packaging Market By Type
11.3.3.14.2 Rest of Western Europe Electronic Packaging Market By Material
11.3.3.14.3 Rest of Western Europe Electronic Packaging Market By Packaging Technology
11.3.3.14.4 Rest of Western Europe Electronic Packaging Market By End User
11.4 Asia-Pacific
11.4.1 Trend Analysis
11.4.2 Asia-Pacific Electronic Packaging Market by Country
11.4.3 Asia-Pacific Electronic Packaging Market By Type
11.4.4 Asia-Pacific Electronic Packaging Market By Material
11.4.5 Asia-Pacific Electronic Packaging Market By Packaging Technology
11.4.6 Asia-Pacific Electronic Packaging Market By End User
11.4.7 China
11.4.7.1 China Electronic Packaging Market By Type
11.4.7.2 China Electronic Packaging Market By Material
11.4.7.3 China Electronic Packaging Market By Packaging Technology
11.4.7.4 China Electronic Packaging Market By End User
11.4.8 India
11.4.8.1 India Electronic Packaging Market By Type
11.4.8.2 India Electronic Packaging Market By Material
11.4.8.3 India Electronic Packaging Market By Packaging Technology
11.4.8.4 India Electronic Packaging Market By End User
11.4.9 Japan
11.4.9.1 Japan Electronic Packaging Market By Type
11.4.9.2 Japan Electronic Packaging Market By Material
11.4.9.3 Japan Electronic Packaging Market By Packaging Technology
11.4.9.4 Japan Electronic Packaging Market By End User
11.4.10 South Korea
11.4.10.1 South Korea Electronic Packaging Market By Type
11.4.10.2 South Korea Electronic Packaging Market By Material
11.4.10.3 South Korea Electronic Packaging Market By Packaging Technology
11.4.10.4 South Korea Electronic Packaging Market By End User
11.4.11 Vietnam
11.4.11.1 Vietnam Electronic Packaging Market By Type
11.4.11.2 Vietnam Electronic Packaging Market By Material
11.4.11.3 Vietnam Electronic Packaging Market By Packaging Technology
11.4.11.4 Vietnam Electronic Packaging Market By End User
11.4.12 Singapore
11.4.12.1 Singapore Electronic Packaging Market By Type
11.4.12.2 Singapore Electronic Packaging Market By Material
11.4.12.3 Singapore Electronic Packaging Market By Packaging Technology
11.4.12.4 Singapore Electronic Packaging Market By End User
11.4.13 Australia
11.4.13.1 Australia Electronic Packaging Market By Type
11.4.13.2 Australia Electronic Packaging Market By Material
11.4.13.3 Australia Electronic Packaging Market By Packaging Technology
11.4.13.4 Australia Electronic Packaging Market By End User
11.4.14 Rest of Asia-Pacific
11.4.14.1 Rest of Asia-Pacific Electronic Packaging Market By Type
11.4.14.2 Rest of Asia-Pacific Electronic Packaging Market By Material
11.4.14.3 Rest of Asia-Pacific Electronic Packaging Market By Packaging Technology
11.4.14.4 Rest of Asia-Pacific Electronic Packaging Market By End User
11.5 Middle East & Africa
11.5.1 Trend Analysis
11.5.2 Middle East
11.5.2.1 Middle East Electronic Packaging Market by Country
11.5.2.2 Middle East Electronic Packaging Market By Type
11.5.2.3 Middle East Electronic Packaging Market By Material
11.5.2.4 Middle East Electronic Packaging Market By Packaging Technology
11.5.2.5 Middle East Electronic Packaging Market By End User
11.5.2.6 UAE
11.5.2.6.1 UAE Electronic Packaging Market By Type
11.5.2.6.2 UAE Electronic Packaging Market By Material
11.5.2.6.3 UAE Electronic Packaging Market By Packaging Technology
11.5.2.6.4 UAE Electronic Packaging Market By End User
11.5.2.7 Egypt
11.5.2.7.1 Egypt Electronic Packaging Market By Type
11.5.2.7.2 Egypt Electronic Packaging Market By Material
11.5.2.7.3 Egypt Electronic Packaging Market By Packaging Technology
11.5.2.7.4 Egypt Electronic Packaging Market By End User
11.5.2.8 Saudi Arabia
11.5.2.8.1 Saudi Arabia Electronic Packaging Market By Type
11.5.2.8.2 Saudi Arabia Electronic Packaging Market By Material
11.5.2.8.3 Saudi Arabia Electronic Packaging Market By Packaging Technology
11.5.2.8.4 Saudi Arabia Electronic Packaging Market By End User
11.5.2.9 Qatar
11.5.2.9.1 Qatar Electronic Packaging Market By Type
11.5.2.9.2 Qatar Electronic Packaging Market By Material
11.5.2.9.3 Qatar Electronic Packaging Market By Packaging Technology
11.5.2.9.4 Qatar Electronic Packaging Market By End User
11.5.2.10 Rest of Middle East
11.5.2.10.1 Rest of Middle East Electronic Packaging Market By Type
11.5.2.10.2 Rest of Middle East Electronic Packaging Market By Material
11.5.2.10.3 Rest of Middle East Electronic Packaging Market By Packaging Technology
11.5.2.10.4 Rest of Middle East Electronic Packaging Market By End User
11.5.3 Africa
11.5.3.1 Africa Electronic Packaging Market by Country
11.5.3.2 Africa Electronic Packaging Market By Type
11.5.3.3 Africa Electronic Packaging Market By Material
11.5.3.4 Africa Electronic Packaging Market By Packaging Technology
11.5.3.5 Africa Electronic Packaging Market By End User
11.5.3.6 Nigeria
11.5.3.6.1 Nigeria Electronic Packaging Market By Type
11.5.3.6.2 Nigeria Electronic Packaging Market By Material
11.5.3.6.3 Nigeria Electronic Packaging Market By Packaging Technology
11.5.3.6.4 Nigeria Electronic Packaging Market By End User
11.5.3.7 South Africa
11.5.3.7.1 South Africa Electronic Packaging Market By Type
11.5.3.7.2 South Africa Electronic Packaging Market By Material
11.5.3.7.3 South Africa Electronic Packaging Market By Packaging Technology
11.5.3.7.4 South Africa Electronic Packaging Market By End User
11.5.3.8 Rest of Africa
11.5.3.8.1 Rest of Africa Electronic Packaging Market By Type
11.5.3.8.2 Rest of Africa Electronic Packaging Market By Material
11.5.3.8.3 Rest of Africa Electronic Packaging Market By Packaging Technology
11.5.3.8.4 Rest of Africa Electronic Packaging Market By End User
11.6 Latin America
11.6.1 Trend Analysis
11.6.2 Latin America Electronic Packaging Market by Country
11.6.3 Latin America Electronic Packaging Market By Type
11.6.4 Latin America Electronic Packaging Market By Material
11.6.5 Latin America Electronic Packaging Market By Packaging Technology
11.6.6 Latin America Electronic Packaging Market By End User
11.6.7 Brazil
11.6.7.1 Brazil Electronic Packaging Market By Type
11.6.7.2 Brazil Electronic Packaging Market By Material
11.6.7.3 Brazil Electronic Packaging Market By Packaging Technology
11.6.7.4 Brazil Electronic Packaging Market By End User
11.6.8 Argentina
11.6.8.1 Argentina Electronic Packaging Market By Type
11.6.8.2 Argentina Electronic Packaging Market By Material
11.6.8.3 Argentina Electronic Packaging Market By Packaging Technology
11.6.8.4 Argentina Electronic Packaging Market By End User
11.6.9 Colombia
11.6.9.1 Colombia Electronic Packaging Market By Type
11.6.9.2 Colombia Electronic Packaging Market By Material
11.6.9.3 Colombia Electronic Packaging Market By Packaging Technology
11.6.9.4 Colombia Electronic Packaging Market By End User
11.6.10 Rest of Latin America
11.6.10.1 Rest of Latin America Electronic Packaging Market By Type
11.6.10.2 Rest of Latin America Electronic Packaging Market By Material
11.6.10.3 Rest of Latin America Electronic Packaging Market By Packaging Technology
11.6.10.4 Rest of Latin America Electronic Packaging Market By End User
12. Company Profiles
12.1 STMicroelectronics
12.1.1 Company Overview
12.1.2 Financial
12.1.3 Products/ Services Offered
12.1.4 The SNS View
12.2 UFP Technologies
12.2.1 Company Overview
12.2.2 Financial
12.2.3 Products/ Services Offered
12.2.4 The SNS View
12.3 Excellatron Solid State
12.3.1 Company Overview
12.3.2 Financial
12.3.3 Products/ Services Offered
12.3.4 The SNS View
12.4 Holst Centre
12.4.1 Company Overview
12.4.2 Financial
12.4.3 Products/ Services Offered
12.4.4 The SNS View
12.5 Dordan Manufacturing Company
12.5.1 Company Overview
12.5.2 Financial
12.5.3 Products/ Services Offered
12.5.4 The SNS View
12.6 AMETEK
12.6.1 Company Overview
12.6.2 Financial
12.6.3 Products/ Services Offered
12.6.4 The SNS View
12.7 Canatu
12.7.1 Company Overview
12.7.2 Financial
12.7.3 Products/ Services Offered
12.7.4 The SNS View
12.8 Front Edge Technology
12.8.1 Company Overview
12.8.2 Financial
12.8.3 Products/ Services Offered
12.8.4 The SNS View
12.9 Infinite Power Solutions
12.9.1 Company Overview
12.9.2 Financial
12.9.3 Products/ Services Offered
12.9.4 The SNS View
12.10 Sealed Air Corporation
12.10.1 Company Overview
12.10.2 Financial
12.10.3 Products/ Services Offered
12.10.4 The SNS View
13. Competitive Landscape
13.1 Competitive Benchmarking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions
14. Use Case and Best Practices
15. Conclusion
An accurate research report requires proper strategizing as well as implementation. There are multiple factors involved in the completion of good and accurate research report and selecting the best methodology to compete the research is the toughest part. Since the research reports we provide play a crucial role in any company’s decision-making process, therefore we at SNS Insider always believe that we should choose the best method which gives us results closer to reality. This allows us to reach at a stage wherein we can provide our clients best and accurate investment to output ratio.
Each report that we prepare takes a timeframe of 350-400 business hours for production. Starting from the selection of titles through a couple of in-depth brain storming session to the final QC process before uploading our titles on our website we dedicate around 350 working hours. The titles are selected based on their current market cap and the foreseen CAGR and growth.
The 5 steps process:
Step 1: Secondary Research:
Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.
Step 2: Primary Research
When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data. This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.
We at SNS Insider have divided Primary Research into 2 parts.
Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.
This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.
Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.
Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.
Step 3: Data Bank Validation
Once all the information is collected via primary and secondary sources, we run that information for data validation. At our intelligence centre our research heads track a lot of information related to the market which includes the quarterly reports, the daily stock prices, and other relevant information. Our data bank server gets updated every fortnight and that is how the information which we collected using our primary and secondary information is revalidated in real time.
Step 4: QA/QC Process
After all the data collection and validation our team does a final level of quality check and quality assurance to get rid of any unwanted or undesired mistakes. This might include but not limited to getting rid of the any typos, duplication of numbers or missing of any important information. The people involved in this process include technical content writers, research heads and graphics people. Once this process is completed the title gets uploader on our platform for our clients to read it.
Step 5: Final QC/QA Process:
This is the last process and comes when the client has ordered the study. In this process a final QA/QC is done before the study is emailed to the client. Since we believe in giving our clients a good experience of our research studies, therefore, to make sure that we do not lack at our end in any way humanly possible we do a final round of quality check and then dispatch the study to the client.
By Type
Corrugated Boxes
Thermoformed Trays
Blister packs and Clamshell
Paperboard Boxes
Bags and Pouches
Protective Packaging
By Material
Plastic
Glass
Metal
Others
By Packaging Technology
Through Hole Mounting
Chip Scale Packages
Surface Mount Technology
By End User
Consumer Electronics
Automotive
Aerospace & Defense
Telecommunication
Request for Segment Customization as per your Business Requirement: Segment Customization Request
REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of the Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Request for Country Level Research Report: Country Level Customization Request
Available Customization
With the given market data, SNS Insider offers customization as per the company’s specific needs. The following customization options are available for the report:
Product Analysis
Criss-Cross segment analysis (e.g. Product X Application)
Product Matrix which gives a detailed comparison of the product portfolio of each company
Geographic Analysis
Additional countries in any of the regions
Company Information
Detailed analysis and profiling of additional market players (Up to five)
ZigBee Wireless Sensor Market Size was valued at USD 2.25 billion in 2023 and is expected to reach USD 4.49 billion by 2031 and grow at a CAGR of 9% over the forecast period 2024-2031.
The Semiconductor Timing IC Market Size was valued at USD 8.08 Billion in 2023 and is expected to reach USD 15.74 Billion, at a CAGR of 7.71% by 2032
The High-frequency Trading Server Market Size was valued at $600 Million in 2023 and is expected to reach $1054.07 Million at a CAGR of 6.47% During 2024-2032
The Real-time Location Systems (RTLS) Market was valued at $5.50 Billion in 2023. It is estimated to reach $30.43 Billion at 20.97% CAGR, during 2024-2032
The Ambient Lighting Market size was valued at USD 66.47 billion in 2023. It is expected to reach USD 160.62 billion by 2032 and grow at a CAGR of 10.30% over the forecast period 2024-2032.
The Industrial Metrology Market size was valued at USD 14 billion in 2023 and is expected to grow to USD 23.4 billion by 2031 and grow at a CAGR of 6.6 % over the forecast period of 2024-2031.
Hi! Click one of our member below to chat on Phone
© 2024 All Rights Reserved by SNS Insider Pvt Ltd
