Advanced Packaging Market report scope & overview:
Advanced Packaging Market Size was valued at USD 31.1 billion in 2023 and is expected to reach USD 54.44 billion by 2031 and grow at a CAGR of 7.25% over the forecast period 2024-2031.
The advanced packaging market is poised for significant growth, driven by the increasing demand for miniaturization and performance improvements in electronic devices. This technology allows for the integration of multiple chips into a single package, leading to faster signal speeds, lower power consumption, and increased functionality.
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Key growth areas include embedded die packaging, which is expected to benefit from the rise of 5G technology and its requirement for compact, efficient devices. The surge in 5G adoption is fueling the advanced packaging market. Ericsson predicts a massive jump in subscriptions, from 12 million to over 4.5 billion by 2028, with Southeast Asia and neighbouring regions leading the charge. This highlights the growing need for compact and efficient devices that advanced packaging solutions can deliver.
The transition from 100mm to 300mm silicon wafers has also significantly impacted the market by reducing manufacturing costs and encouraging investment in innovative packaging solutions. However, the market faces challenges due to potential disruptions in product support after mergers and acquisitions, particularly for industries reliant on long-lived devices. With major players in the market consolidating to remain competitive, navigating this trend will be crucial for the future of advanced packaging.
MARKET DYNAMICS:
KEY DRIVERS:
The electronics industry's growing demand for miniaturization of devices is driving the need for advanced packaging solutions.
The tech world desires ever-smaller devices, from smartphones to medical implants. This miniaturization trend across industries like consumer electronics, healthcare, and automotive is pushing manufacturers to rethink traditional packaging solutions. Advanced packaging techniques are crucial to fit complex components into these compact devices, ensuring everything functions flawlessly.
Advanced packaging offers the potential to significantly improve system performance and optimize device miniaturization.
RESTRAINTS:
The high cost of advanced packaging remains a significant hurdle to its widespread adoption across various industries.
Compared to traditional methods, advanced packaging is significantly more expensive. This high cost is a result of several factors, including the inherent expensiveness of designing and manufacturing chips at advanced levels, the increased complexity of wafer fabrication for intricate circuits, and the elaborate packaging process itself. These high costs are a hurdle that needs to be overcome for advanced packaging to see widespread adoption.
The potential disruption to existing technology support after acquisitions could hinder market growth, especially for industries relying on devices with long lifespans.
OPPORTUNITIES:
The medical device industry is seeing a rise in demand for miniaturized equipment for robotic surgery and sophisticated wearable health gadgets.
Advanced packaging boosts AI by tightly linking components for faster, smarter processing, attracting industries like auto and healthcare.
Advanced packaging technology unlocks the power of artificial intelligence (AI), machine learning, and deep learning by enabling the interconnection of various processing elements and memory units through high-speed connections. This translates to enhanced operational capabilities and more precise processing, making advanced packaging a valuable asset for industries like automotive, healthcare, aerospace & defence, and industrial applications. As a result, these sectors are increasingly adopting advanced packaging solutions to improve their products' functionality and performance.
CHALLENGES:
The global financial crisis brought about stricter regulations and a new market landscape, impacting advanced packaging.
The global financial crisis left its mark on the advanced packaging market through stricter regulations and a fundamentally changed market landscape. In response, companies providing outsourced semiconductor assembly and test services have ramped up mergers and acquisitions (M&A) activity to stay competitive. This trend of consolidation among major players is expected to continue in the coming years, potentially reshaping the industry structure.
IMPACT OF RUSSIA-UKRAINE WAR
The war in Ukraine is creating impact across the advanced packaging market. Disruptions to the supply chain due to depleted weapon stockpiles in Western nations and sanctions on Russia could impact the availability of key metals like cobalt and nickel, critical materials for advanced packaging substrates and interconnects. A shortage of these metals could potentially lead to production slowdowns or limitations, impacting lead times and potentially raising costs for advanced packaging materials. Additionally, rising energy costs stemming from the conflict could increase transportation costs throughout the supply chain, further pressuring margins for advanced packaging manufacturers. While the overall impact on the market remains to be seen, these factors combined could potentially lead to price hikes for advanced packaging solutions, potentially dampening demand in the short term.
IMPACT OF ECONOMIC SLOWDOWN
The advanced packaging market faces a challenging road ahead due to a potential economic slowdown. Consumer spending might decline, and raw material costs could fluctuate wildly due to geopolitical tensions. Additionally, subdued economic growth might dampen overall demand. To navigate these challenges, industry players need to adapt their supply chains, prioritize sustainability practices, and collaborate effectively to establish a robust regulatory framework. While challenges exist, this period can also be an opportunity for innovation and building resilience through strategic partnerships and a strong commitment to environmental responsibility.
KEY MARKET SEGMENTS:
By Type
Flip Chip Scale Package
Flip Chip Ball Grid Array
Wafer Level Chip Scale Packaging
5D/3D
Fan Out Wafer-level Packaging
Others
Flip-chip packaging is dominating in the advanced packaging with 60% market share, due to its space-saving design and ability to handle complex electronics for applications like AI and IoT devices. It offers shorter connections for faster signals and more connection points in a smaller area.
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By End User
Consumer Electronics
Healthcare
Industrial
Aerospace and Défense
Automotive
Other
The consumer electronics market is expected to be the biggest user of advanced packaging for the next decade. This is driven by the growing popularity of smart home devices and people's desire for the latest tech in their homes, all leading to a need for more advanced packaging solutions.
REGIONAL ANALYSES
The Asia Pacific region is expected to dominate the advanced packaging market. This dominance is fueled by several factors such as the presence of major semiconductor manufacturers like China and Taiwan, rapid industrialization across the region, and a booming consumer electronics market. Additionally, Asia Pacific is known for its high-volume semiconductor production and adoption of advanced packaging technologies in various industries like consumer electronics, automotive, and telecommunications. These factors combined are creating a lucrative opportunity for advanced packaging market players in the region. China, for example is heavily invested in its domestic chip industry with a $150 billion government fund and a new state-backed investment fund of $40 billion planned for 2023. This strong push for domestic chip production will significantly increase the demand for advanced packaging services in the region.
The US advanced packaging market is expected to reach nearly $8.9 billion by 2031. This growth is fueled by major players like Intel investing heavily in research and development facilities within the US. These efforts are focused on creating innovative packaging solutions like flip chip and fan-out wafer-level packaging. Intel's Foveros 3D technology is a prime example, promising significant performance gains. These advancements position the US as a key player from North America region in the advanced packaging industry.
REGIONAL COVERAGE:
North America
US
Canada
Mexico
Europe
Eastern Europe
Poland
Romania
Hungary
Turkey
Rest of Eastern Europe
Western Europe
Germany
France
UK
Italy
Spain
Netherlands
Switzerland
Austria
Rest of Western Europe
Asia Pacific
China
India
Japan
South Korea
Vietnam
Singapore
Australia
Rest of Asia Pacific
Middle East & Africa
Middle East
UAE
Egypt
Saudi Arabia
Qatar
Rest of Middle East
Africa
Nigeria
South Africa
Rest of Africa
Latin America
Brazil
Argentina
Colombia
Rest of Latin America
KEY PLAYERS
The major key players are Jiangsu Changjiang Electronics Technology Co. Ltd., China Wafer Level CSP Co. Ltd., ASE Technology Holding Co. Ltd., King Yuan Electronics Corp., ChipMOS Technologies Inc., FlipChip International LLC, Powertech Technology Inc., Amkor Technology Inc., HANA Micron Inc., Nepes Corporation, Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., UTAC, TEXAS INSTRUMENTS, MICROCHIP TECHNOLOGY INC., QUALCOMM TECHNOLOGIES, INC. and other players.
Jiangsu Changjiang Electronics Technology Co. Ltd-Company Financial Analysis
RECENT DEVELOPMENT
In July 2023, Amkor Technology highlighted its progress in developing packaging solutions for chips made with TSMC's advanced low-k technology. They've been collaborating with multiple clients to qualify these new packages and are gearing up for a significant increase in production volume later this year.
In November 2022, Intel launched construction of a new facility in Penang to expand its manufacturing capabilities. This big factory will create two buildings and bring 2,700 new jobs to the area by 2025. The factory will put together and test computer chips.
Amkor Technology stepped up its commitment to the European automotive industry in October 2022. They plan to ramp up semiconductor production to meet the growing demand for advanced technologies like driver-assistance systems and in-car entertainment systems in European cars.
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | US$ 31.1 Bn |
| Market Size by 2031 | US$ 54.44 Bn |
| CAGR | CAGR of 7.25% From 2024 to 2031 |
| Base Year | 2023 |
| Forecast Period | 2024-2031 |
| Historical Data | 2020-2022 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-Level Packaging, Others) • By End User (Consumer Electronics, Healthcare, Industrial, Aerospace And Defense, Automotive, Other) |
| Regional Analysis/Coverage | North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia Rest of Latin America) |
| Company Profiles | Jiangsu Changjiang Electronics Technology Co. Ltd., China Wafer Level CSP Co. Ltd., ASE Technology Holding Co. Ltd., King Yuan Electronics Corp., ChipMOS Technologies Inc., FlipChip International LLC, Powertech Technology Inc., Amkor Technology Inc., HANA Micron Inc., Nepes Corporation, Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., UTAC, TEXAS INSTRUMENTS, MICROCHIP TECHNOLOGY INC., QUALCOMM TECHNOLOGIES, INC. |
| Key Drivers | • The electronics industry's growing demand for miniaturization of devices is driving the need for advanced packaging solutions. • Advanced packaging offers the potential to significantly improve system performance and optimize device miniaturization. |
| Key Restraints | • The high cost of advanced packaging remains a significant hurdle to its widespread adoption across various industries. • The potential disruption to existing technology support after acquisitions could hinder market growth, especially for industries relying on devices with long lifespans |
Ans: The Advanced Packaging Market is expected to grow at a CAGR of 7.25%.
Ans: Advanced Packaging Market size was USD 31.1 billion in 2023 and is expected to Reach USD 54.44 billion by 2031.
Ans: The electronics industry's growing demand for miniaturization of devices is driving the need for advanced packaging solutions.
Ans: The high cost of advanced packaging remains a significant hurdle to its widespread adoption across various industries.
Ans: Asia-Pacific expected to hold the dominant position in the Advanced Packaging Market.
Table of Contents
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Industry Flowchart
3. Research Methodology
4. Market Dynamics
4.1 Drivers
4.2 Restraints
4.3 Opportunities
4.4 Challenges
5. Impact Analysis
5.1 Impact Of Russia Ukraine Crisis
5.2 Impact of Economic Slowdown on Major Countries
5.2.1 Introduction
5.2.2 United States
5.2.3 Canada
5.2.4 Germany
5.2.5 France
5.2.6 UK
5.2.7 China
5.2.8 Japan
5.2.9 South Korea
5.2.10 India
6. Value Chain Analysis
7. Porter’s 5 Forces Model
8. Pest Analysis
9. Advanced Packaging Market Segmentation, By Type
9.1 Introduction
9.2 Trend Analysis
9.3 Flip Chip Scale Package
9.4 Flip Chip Ball Grid Array
9.5 Wafer Level Chip Scale Packaging
9.6 5D/3D
9.7 Fan Out Wafer-level Packaging
9.8 Others
10. Advanced Packaging Market Segmentation, By End User
10.1 Introduction
10.2 Trend Analysis
10.3 Consumer Electronics
10.4 Healthcare
10.5 Industrial
10.6 Aerospace and Defense
10.7 Automotive
10.8 Other
11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1 Trend Analysis
11.2.2 North America Advanced Packaging Market by Country
11.2.3 North America Advanced Packaging Market By Type
11.2.4 North America Advanced Packaging Market By End User
11.2.5 USA
11.2.5.1 USA Advanced Packaging Market By Type
11.2.5.2 USA Advanced Packaging Market By End User
11.2.6 Canada
11.2.6.1 Canada Advanced Packaging Market By Type
11.2.6.2 Canada Advanced Packaging Market By End User
11.2.7 Mexico
11.2.7.1 Mexico Advanced Packaging Market By Type
11.2.7.2 Mexico Advanced Packaging Market By End User
11.3 Europe
11.3.1 Trend Analysis
11.3.2 Eastern Europe
11.3.2.1 Eastern Europe Advanced Packaging Market by Country
11.3.2.2 Eastern Europe Advanced Packaging Market By Type
11.3.2.3 Eastern Europe Advanced Packaging Market By End User
11.3.2.4 Poland
11.3.2.4.1 Poland Advanced Packaging Market By Type
11.3.2.4.2 Poland Advanced Packaging Market By End User
11.3.2.5 Romania
11.3.2.5.1 Romania Advanced Packaging Market By Type
11.3.2.5.2 Romania Advanced Packaging Market By End User
11.3.2.6 Hungary
11.3.2.6.1 Hungary Advanced Packaging Market By Type
11.3.2.6.2 Hungary Advanced Packaging Market By End User
11.3.2.7 Turkey
11.3.2.7.1 Turkey Advanced Packaging Market By Type
11.3.2.7.2 Turkey Advanced Packaging Market By End User
11.3.2.8 Rest of Eastern Europe
11.3.2.8.1 Rest of Eastern Europe Advanced Packaging Market By Type
11.3.2.8.2 Rest of Eastern Europe Advanced Packaging Market By End User
11.3.3 Western Europe
11.3.3.1 Western Europe Advanced Packaging Market by Country
11.3.3.2 Western Europe Advanced Packaging Market By Type
11.3.3.3 Western Europe Advanced Packaging Market By End User
11.3.3.4 Germany
11.3.3.4.1 Germany Advanced Packaging Market By Type
11.3.3.4.2 Germany Advanced Packaging Market By End User
11.3.3.5 France
11.3.3.5.1 France Advanced Packaging Market By Type
11.3.3.5.2 France Advanced Packaging Market By End User
11.3.3.6 UK
11.3.3.6.1 UK Advanced Packaging Market By Type
11.3.3.6.2 UK Advanced Packaging Market By End User
11.3.3.7 Italy
11.3.3.7.1 Italy Advanced Packaging Market By Type
11.3.3.7.2 Italy Advanced Packaging Market By End User
11.3.3.8 Spain
11.3.3.8.1 Spain Advanced Packaging Market By Type
11.3.3.8.2 Spain Advanced Packaging Market By End User
11.3.3.9 Netherlands
11.3.3.9.1 Netherlands Advanced Packaging Market By Type
11.3.3.9.2 Netherlands Advanced Packaging Market By End User
11.3.3.10 Switzerland
11.3.3.10.1 Switzerland Advanced Packaging Market By Type
11.3.3.10.2 Switzerland Advanced Packaging Market By End User
11.3.3.11 Austria
11.3.3.11.1 Austria Advanced Packaging Market By Type
11.3.3.11.2 Austria Advanced Packaging Market By End User
11.3.3.12 Rest of Western Europe
11.3.3.12.1 Rest of Western Europe Advanced Packaging Market By Type
11.3.2.12.2 Rest of Western Europe Advanced Packaging Market By End User
11.4 Asia-Pacific
11.4.1 Trend Analysis
11.4.2 Asia Pacific Advanced Packaging Market by Country
11.4.3 Asia Pacific Advanced Packaging Market By Type
11.4.4 Asia Pacific Advanced Packaging Market By End User
11.4.5 China
11.4.5.1 China Advanced Packaging Market By Type
11.4.5.2 China Advanced Packaging Market By End User
11.4.6 India
11.4.6.1 India Advanced Packaging Market By Type
11.4.6.2 India Advanced Packaging Market By End User
11.4.7 Japan
11.4.7.1 Japan Advanced Packaging Market By Type
11.4.7.2 Japan Advanced Packaging Market By End User
11.4.8 South Korea
11.4.8.1 South Korea Advanced Packaging Market By Type
11.4.8.2 South Korea Advanced Packaging Market By End User
11.4.9 Vietnam
11.4.9.1 Vietnam Advanced Packaging Market By Type
11.4.9.2 Vietnam Advanced Packaging Market By End User
11.4.10 Singapore
11.4.10.1 Singapore Advanced Packaging Market By Type
11.4.10.2 Singapore Advanced Packaging Market By End User
11.4.11 Australia
11.4.11.1 Australia Advanced Packaging Market By Type
11.4.11.2 Australia Advanced Packaging Market By End User
11.4.12 Rest of Asia-Pacific
11.4.12.1 Rest of Asia-Pacific Advanced Packaging Market By Type
11.4.12.2 Rest of Asia-Pacific Advanced Packaging Market By End User
11.5 Middle East & Africa
11.5.1 Trend Analysis
11.5.2 Middle East
11.5.2.1 Middle East Advanced Packaging Market by Country
11.5.2.2 Middle East Advanced Packaging Market By Type
11.5.2.3 Middle East Advanced Packaging Market By End User
11.5.2.4 UAE
11.5.2.4.1 UAE Advanced Packaging Market By Type
11.5.2.4.2 UAE Advanced Packaging Market By End User
11.5.2.5 Egypt
11.5.2.5.1 Egypt Advanced Packaging Market By Type
11.5.2.5.2 Egypt Advanced Packaging Market By End User
11.5.2.6 Saudi Arabia
11.5.2.6.1 Saudi Arabia Advanced Packaging Market By Type
11.5.2.6.2 Saudi Arabia Advanced Packaging Market By End User
11.5.2.7 Qatar
11.5.2.7.1 Qatar Advanced Packaging Market By Type
11.5.2.7.2 Qatar Advanced Packaging Market By End User
11.5.2.8 Rest of Middle East
11.5.2.8.1 Rest of Middle East Advanced Packaging Market By Type
11.5.2.8.2 Rest of Middle East Advanced Packaging Market By End User
11.5.3 Africa
11.5.3.1 Africa Advanced Packaging Market by Country
11.5.3.2 Africa Advanced Packaging Market By Type
11.5.3.3 Africa Advanced Packaging Market By End User
11.5.2.4 Nigeria
11.5.2.4.1 Nigeria Advanced Packaging Market By Type
11.5.2.4.2 Nigeria Advanced Packaging Market By End User
11.5.2.5 South Africa
11.5.2.5.1 South Africa Advanced Packaging Market By Type
11.5.2.5.2 South Africa Advanced Packaging Market By End User
11.5.2.6 Rest of Africa
11.5.2.6.1 Rest of Africa Advanced Packaging Market By Type
11.5.2.6.2 Rest of Africa Advanced Packaging Market By End User
11.6 Latin America
11.6.1 Trend Analysis
11.6.2 Latin America Advanced Packaging Market by Country
11.6.3 Latin America Advanced Packaging Market By Type
11.6.4 Latin America Advanced Packaging Market By End User
11.6.5 Brazil
11.6.5.1 Brazil Advanced Packaging Market By Type
11.6.5.2 Brazil Advanced Packaging Market By End User
11.6.6 Argentina
11.6.6.1 Argentina Advanced Packaging Market By Type
11.6.6.2 Argentina Advanced Packaging Market By End User
11.6.7 Colombia
11.6.7.1 Colombia Advanced Packaging Market By Type
11.6.7.2 Colombia Advanced Packaging Market By End User
11.6.8 Rest of Latin America
11.6.8.1 Rest of Latin America Advanced Packaging Market By Type
11.6.8.2 Rest of Latin America Advanced Packaging Market By End User
12. Company Profiles
12.1 Jiangsu Changjiang Electronics Technology Co. Ltd.
12.1.1 Company Overview
12.1.2 Financial
12.1.3 Products/ Services Offered
12.1.4 SWOT Analysis
12.1.5 The SNS View
12.2 China Wafer Level CSP Co. Ltd.
12.2.1 Company Overview
12.2.2 Financial
12.2.3 Products/ Services Offered
12.2.4 SWOT Analysis
12.2.5 The SNS View
12.3 ASE Technology Holding Co. Ltd.
12.3.1 Company Overview
12.3.2 Financial
12.3.3 Products/ Services Offered
12.3.4 SWOT Analysis
12.3.5 The SNS View
12.4 King Yuan Electronics Corp.
12.4.1 Company Overview
12.4.2 Financial
12.4.3 Products/ Services Offered
12.4.4 SWOT Analysis
12.4.5 The SNS View
12.5 ChipMOS Technologies Inc.
12.5.1 Company Overview
12.5.2 Financial
12.5.3 Products/ Services Offered
12.5.4 SWOT Analysis
12.5.5 The SNS View
12.6 FlipChip International LLC
12.6.1 Company Overview
12.6.2 Financial
12.6.3 Products/ Services Offered
12.6.4 SWOT Analysis
12.6.5 The SNS View
12.7 Powertech Technology Inc.
12.7.1 Company Overview
12.7.2 Financial
12.7.3 Products/ Services Offered
12.7.4 SWOT Analysis
12.7.5 The SNS View
12.8 Amkor Technology Inc.
12.8.1 Company Overview
12.8.2 Financial
12.8.3 Products/ Services Offered
12.8.4 SWOT Analysis
12.8.5 The SNS View
12.9 HANA Micron Inc.
12.9.1 Company Overview
12.9.2 Financial
12.9.3 Products/ Services Offered
12.9.4 SWOT Analysis
12.9.5 The SNS View
12.10 Nepes Corporation
12.10.1 Company Overview
12.10.2 Financial
12.10.3 Products/ Services Offered
12.10.4 SWOT Analysis
12.10.5 The SNS View
12.11 Taiwan Semiconductor Manufacturing Company Limited
12.11.1 Company Overview
12.11.2 Financial
12.11.3 Products/ Services Offered
12.11.4 SWOT Analysis
12.11.5 The SNS View
12.12 TongFu Microelectronics Co., Ltd.
12.12.1 Company Overview
12.12.2 Financial
12.12.3 Products/ Services Offered
12.12.4 SWOT Analysis
12.12.5 The SNS View
12.13 UTAC
12.13.1 Company Overview
12.13.2 Financial
12.13.3 Products/ Services Offered
12.13.4 SWOT Analysis
12.13.5 The SNS View
12.14 TEXAS INSTRUMENTS
12.14.1 Company Overview
12.14.2 Financial
12.14.3 Products/ Services Offered
12.14.4 SWOT Analysis
12.14.5 The SNS View
12.15 MICROCHIP TECHNOLOGY INC.
12.15.1 Company Overview
12.15.2 Financial
12.15.3 Products/ Services Offered
12.15.4 SWOT Analysis
12.15.5 The SNS View
12.16 QUALCOMM TECHNOLOGIES, INC.
12.16.1 Company Overview
12.16.2 Financial
12.16.3 Products/ Services Offered
12.16.4 SWOT Analysis
12.16.5 The SNS View
13. Competitive Landscape
13.1 Competitive Benchmarking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions
14. USE Cases And Best Practices
15. Conclusion
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